Date：2022-04-07 15:20:44

With the continuous development of the electronic industry, the demand for PCB board also increases. The common surface processes of PCB board include tin spraying, gold deposition, gold plating, OSP, etc. in fact, tin spraying is divided into lead-free tin spraying and lead-free tin spraying. Next, we will mainly talk about the inspection standards of lead-free process and introduce the difference between lead-free and lead-free PCB board. View >>

Date：2022-04-07 15:14:28

DPA analysis (destructive physical analysis) is destructive physical analysis. It is to randomly select appropriate samples from the finished batch of electronic components, and adopt a series of non-destructive and destructive physical test and analysis methods to test whether the design, structure, material and manufacturing quality of components meet the specification requirements of the intended use. View >>

Date：2022-04-07 15:01:36

The reliability test of lead-free solder joint is mainly the heat load test (temperature shock or temperature cycle test) for electronic assembly products; Carry out mechanical stress test on the junction of electronic devices according to the fatigue life test conditions; Use the model for life assessment. At present, the well-known model is the coffin Manson model of low cycle fatigue. Generally, the modified coffin Manson model is used when considering the influence of average temperature and frequency, while the coffin Manson model is used when considering the temperature characteristics and creep relationship of materials. View >>

Date：2022-04-06 15:46:00

First of all, what is the ROHS certification promoted by the state? In May 2011, the national RoHS voluntary certification supporting standards "limit requirements for restricted substances in electronic and electrical products" (GB / T 26572-2011) and "determination of six restricted substances in electronic and electrical products (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers)" (GB / T 26125-2011 / IEC 62321:2008) were officially released. In November 2011, the national implementation rules for voluntary certification of pollution control of electronic information products was officially implemented. View >>

Date：2022-04-06 15:41:00

ROHS certification involves a wide range of products, covering almost all electronic, electrical, medical, communication, toys, security information and other products. It includes not only the whole machine products, but also the parts, raw materials and packaging used in the production of the whole machine, which is related to the whole production chain. View >>

Date：2022-04-06 15:36:15

Industrial CT is a testing field rising in recent decades. Because of its nondestructive, intuitive, quantifiable and other advantages, it has been widely used in all walks of life, especially in the fields of automobile, aerospace, military, electronics, medical devices and so on. CT based defect analysis has been widely used today, such as castings, plastic parts and BGAs. Quickly, accurately and intuitively find the internal defects of the product (defect type, location, size, etc.), such as cracks, pores, porosity, inclusions and other defects, and analyze them to find the root cause of the defects, so as to improve the product performance and prolong the service life of the product. View >>

Date：2022-04-06 15:28:00

In order to implement the tasks proposed in the 14th five year plan for industrial green development, such as strictly implementing the control requirements for the restricted use of hazardous substances in electrical and electronic products, updating the catalogue of the control scope of electrical and electronic products, and formulating and revising the mandatory standards for the content limits of hazardous substances in electrical and electronic products, The working group on pollution control standards for electrical and electronic products of the Ministry of industry and information technology held the "kick-off meeting on deepening the management of restrictions on the use of hazardous substances in electrical and electronic products". View >>

Date：2022-04-02 17:45:53

In the stage of workpiece design and R & D, the internal defects of the workpiece are detected through industrial CT, and the size of the measured structure is compared with the design value to find the position and size of the deviation and assist in the improvement of the manufacturing process. After the workpiece is manufactured, its defects or dimensions need to be measured to check whether it meets the standard. Industrial CT measurement also plays an important role in the assembly parts. After the parts are assembled, the internal structure can not be seen. For the parts with strict requirements for the assembly structure, measure the size of the assembly structure through industrial CT, whether the channel is blocked, whether the channel is too narrow, whether the docking is close, etc. The following is a brief analysis of industrial CT test for your reference. View >>

Date：2022-04-02 17:26:56

At present, most of the electronic components commonly used in integrated circuits are sealed with epoxy resin or other glue and alloy, and there is often the phenomenon of circuit board soldering. Therefore, detecting circuit board soldering is a very important link. False soldering of circuit board has always been a common problem in the electronic industry. Due to the compact and complex internal structure and miniaturized shape of electronic products, ordinary testing instruments can not detect their internal defects. Therefore, it is difficult to solve the problem of how to effectively detect false soldering of circuit board. To solve this problem, the skilled workers in the factory came up with various methods: View >>

Date：2022-04-01 17:02:07

Chip is the carrier of integrated circuit, which is divided by wafer. There are traces of chip in our smart phones, computers, televisions, automobiles and air conditioners. As an electronic component with high integration and precise structure, and the continuous emergence of various new packaging technologies, the requirements for circuit assembly quality are higher and higher. The chip X-ray detection equipment mainly uses the X-ray generated in the X-ray inspection machine to irradiate the inside of the chip. The X-ray has strong penetration and can image after penetrating the chip. The internal structure fracture of the chip can be seen at a glance. The main feature of using X-ray to detect the chip is that there is no damage to the chip itself. Therefore, this detection method is also called nondestructive testing. View >>