Date：2022-05-20 17:28:25

Inductance is a physical quantity that measures the ability of the coil to produce electromagnetic induction. When a current is applied to a coil, a magnetic field will be generated around the coil, and the coil will have magnetic flux to pass through. The greater the power supply to the coil, the stronger the magnetic field and the greater the magnetic flux through the coil. Experiments show that the magnetic flux passing through the coil is directly proportional to the incoming current. Their ratio is called self inductance, also known as inductance. View >>

Date：2022-05-18 15:43:56

False welding and false welding reduce the reliability of products, cause unnecessary maintenance to the production process, increase the production cost, reduce the production efficiency, cause great quality and safety hazards to the products that have left the factory, increase the after-sales maintenance cost, increase the mistrust of customers, reduce orders and affect the image of the company. How to judge whether there is faulty soldering of components? What are the general reasons for the faulty soldering of components? In order to help you have an in-depth understanding, the following contents are sorted out by Chuangxin testing network for your reference. View >>

Date：2022-05-18 15:39:45

The failure modes of metal materials in various engineering applications are mainly composed of fracture, corrosion, wear and deformation. Fracture failure analysis starts with the macro and micro characteristics of cracks and fractures, and studies the relationship between fracture process and morphological characteristics and material properties, microstructure, stress state of parts and environmental conditions, so as to reveal the causes and laws of fracture failure. The following is a brief analysis of various fracture failure analysis types of metals for your reference. View >>

Date：2022-05-18 15:34:50

The three elements of pfema are quantitative risk assessment, listing causes / mechanisms and looking for preventive / improvement measures. PFMEA: Process FMEA, which is used for reliability analysis in process design. The analysis objects are new products / processes and changed products / processes. Generally, PFMEA is used before the preparation of production tooling until the product is officially put into production. After putting into production, PFMEA should be continuously updated according to the changes of production process. In order to help you have an in-depth understanding, this paper will summarize the relevant knowledge of product potential failure mode and consequence analysis. If you are interested in what this article will cover, read on. View >>

Date：2022-05-18 15:29:47

Some customers feed back the bad burning during mass production. Is this the problem of the chip itself? Or the problem with the burner? Or what other possibilities? In order to help you have an in-depth understanding, this paper will summarize the relevant knowledge of IC chip burning. If you are interested in what this article will cover, read on. View >>

Date：2022-05-17 15:32:01

In the reflow soldering process of surface mount process, the chip components will have the defect of off soldering due to warping, which is vividly called "monument" phenomenon (also known as "Manhattan" phenomenon). Reflow soldering is also a very important link in SMT process, but in practical operation, we often see that there are many small chip components, especially chip resistors, which have the monument defect of desoldering and erection of chip components. This "monument" phenomenon usually occurs in the reflow welding process of chip components (such as chip capacitor and chip resistor). The smaller the component volume, the more likely it is to occur. For example, this phenomenon occurs most in 0603 and 0402 components. There are many reasons for this phenomenon, and it is difficult for us to completely eliminate the "monument" phenomenon. however View >>

Date：2022-05-17 15:27:57

For chip components, the appearance of good solder joints shall be smooth, bright and continuous, the edges shall gradually become thin and straight, and the bottom layer of the front end shall not be exposed or have sharp protrusions. There is no deviation in part position, part crack, notch and damage, and port electrodeposition. In order to help you have an in-depth understanding, the following contents are sorted out by Chuangxin testing network for your reference. View >>

Date：2022-05-17 15:22:59

FMEA failure mode and effect analysis. FMEA failure mode and effect analysis is an "ex ante behavior" rather than an "ex post behavior". In order to achieve the best benefit, FMEA must be carried out before the failure mode is incorporated into the product. View >>

Date：2022-05-17 15:10:36

Reliability can comprehensively reflect the quality of products. The reliability of electronic components is the basis of the reliability of electronic equipment. In order to improve the reliability of equipment or system, we must improve the reliability of electronic components. Reliability is an important quality index of electronic components, which must be examined and tested. In order to help you have an in-depth understanding, this paper will summarize the relevant knowledge of the reliability of electronic components in low pressure environment. If you are interested in what this article will cover, read on. View >>

Date：2022-05-17 15:02:00

After reflow soldering of electronic product circuit board, due to various reasons such as reflow soldering equipment, circuit board, worker operation, solder paste, chip mounter, etc., it is often seen that some products have various adverse phenomena. If these adverse phenomena are not strictly controlled, they will cause serious consequences to the company. The following is a detailed analysis of the adverse phenomena of reflow soldering quality defects and puts forward corresponding solutions. If you are interested in what this article will cover, read on. View >>