Date：2022-05-26 16:26:53

In general, the distribution of copper foil on PCB circuit board is very complex, which is difficult to accurately model. Therefore, when modeling, it is necessary to simplify the shape of wiring and try to make an ANSYS model close to the actual circuit board. The electronic components on the circuit board can also be simulated by simplified modeling, such as MOS tube, integrated circuit block, etc. View >>

Date：2022-05-26 16:00:00

The Flotherm software proposed in this paper plays a great role in analyzing heat transfer, especially suitable for the analysis and judgment of thermal reliability of electronic circuit boards. The key to its application in the thermal reliability analysis of electronic circuit board is how to build a reasonable and effective Flotherm model, in order to ensure the accuracy and meet the capacity requirements of computer memory. View >>

Date：2022-05-25 14:52:51

SMT reflow soldering is a very important SMT process. It is a welding process in which the chip components are combined with the pad on the circuit board through high temperature and then cooled together, which has a great impact on the service stability of the circuit board. Some process defects are also easy to appear in reflow welding. It is necessary to analyze the causes and solve them to ensure product quality. In order to help you have an in-depth understanding, this paper will summarize the relevant knowledge of reflow defect analysis. If you are interested in what this article will cover, read on. View >>

Date：2022-05-25 14:48:49

Overview of nondestructive testing: NDT (non destructive testing) is the general name of all technical means to use acoustic, optical, magnetic and electrical characteristics to detect whether there are defects or non-uniformity in the tested object without damaging or affecting the service performance of the tested object, give information such as the size, location, nature and quantity of defects, and then determine the technical state of the tested object (such as qualified or not, remaining life, etc.). View >>

Date：2022-05-25 14:36:04

The two major contents of reliability research are failure analysis and reliability test (including destructive experiment). The two affect and restrict each other. The rapid development of electronic component technology and the improvement of reliability have laid the foundation of modern electronic equipment. The fundamental task of component reliability is to improve the reliability of components. Therefore, we must pay attention to and accelerate the development of reliability analysis of components, determine the failure mechanism through analysis, find out the failure causes, feed back to design, manufacturing and use, and jointly study and implement corrective measures to improve the reliability of electronic components. View >>

Date：2022-05-25 14:33:03

Due to the particularity of their profession, nondestructive testing personnel have a qualification access mechanism to control their quality. In short, they need to work with certificates. Personnel engaged in nondestructive testing shall undergo strict training and assessment according to the provisions of relevant regulations or technical conditions, hold the grade qualification certificate issued by relevant examination organizations, engage in the inspection of corresponding assessment items, and the signature on the test report will have legal effect. View >>

Date：2022-05-23 16:41:38

Will the capacitor fail after being discharged for a long time? The electrolytic capacitor cannot be stored for a long time. During the long-term storage process, the electrolytic capacitor needs to be excited by applying the rated voltage regularly to maintain the activity of the electrolyte, otherwise the electrolyte in the capacitor will lose its activity and age. Once the electrolyte loses its activity and age, the consequences will be more serious, and the electrolytic capacitor will be invalid and scrapped. The positive electrode, negative electrode lead-out electrode and shell of aluminum electrolytic capacitor are high-purity aluminum. The medium of aluminum electrolytic capacitor is aluminum oxide film formed on the surface of the positive electrode. The real negative electrode is electrolyte. When working, it is equivalent to an electrolytic cell, but the anodic oxide layer on the surface of the positive electrode has been formed and there is no electrochemical reaction. Theoretically, the current is zero. Due to the existence of impurities in the electrode and electrolyte, it will cause small leakage current. View >>

Date：2022-05-23 16:25:16

As a kind of processor, burning chip needs a program to miniaturize all components into one or several integrated circuits; An integrated circuit that can receive coding instructions at one or more ends, execute the instructions and output signals describing its state, and the process of storing programs in the chip is called chip burning. What processes do I need to master for IC burning? First of all, why should IC burn? View >>

Date：2022-05-23 16:23:08

FMECA (failure mode effects and criticality analysis), i.e. failure mode effects and criticality analysis method. There is a certain causal relationship between the overall fault of the system, the fault of parts and components and the system. Starting from this relationship, FMECA analyzes each possible potential failure mode of each component of the system, finds out the cause of the failure, determines the impact of the failure on system function, service performance, personnel safety and maintenance, classifies each potential failure according to the severity of the impact and the comprehensive effect of the probability of failure, and finds out the key problems, Propose possible preventive and corrective measures (e.g. for design View >>

Date：2022-05-20 17:32:35

The development of chip manufacturing industry is related to all aspects of people's life, ranging from mobile phones, computers, household appliances, to automobiles, aircraft, military, communication and national defense, which are inseparable from the support of the chip industry. Therefore, the reliability of chips is particularly important. Since most chips need full inspection, chip nondestructive testing is particularly important. According to the control of product quality, X-ray testing equipment is often used for product fault analysis. The characteristics of nondestructive testing are very effective for detecting internal defects of products. So, which method is better for IC chip nondestructive testing? View >>