Date：2022-06-01 15:20:14

With the increasing demand for miniaturization of electronic devices, the functions of single chip are increasing. In the current process, in order to ensure the quality of chips, chip detection is generally carried out in the process from design and molding to mass production. The traditional chip debugging technology is to add a set of function oriented test program on the basis of chip functions. It can only detect whether the chip has errors or faults, and can not accurately locate the errors on the chip terminal. It can only be judged according to the experience of testers, which will cause slow chip detection speed and low efficiency. Since each functional element has its own test requirements, the design engineer must make a test plan at the early design stage. View >>

Date：2022-06-01 15:10:57

CNAs mark is the abbreviation of chinanationalaccreditation serviceforconformity assessment. Based on comments. Supervise the management methods and subject activities of quality certification organizations (such as authoritative certification, laboratories and inspection organizations), and determine whether they have the strength to carry out relative quality certification subject activities (such as verification, inspection, correction, inspection, etc.). View >>

Date：2022-06-01 14:49:49

High and low temperature test, also known as high and low temperature cycle test, is one of the environmental reliability tests. Basically, all products are stored or operated at a certain temperature. In some environments, the temperature will change from high to low. This changing temperature environment will affect the function, performance, quality and service life of the product, accelerate the aging of the product and shorten the service life of the product. If the product is in such a high-temperature and low-temperature environment with large alternating changes for a long time, it needs to have sufficient resistance to high-temperature and low-temperature cycles. In this way, we need to simulate certain environmental conditions to test the products at high and low temperatures. High and low temperature test is a necessary test item for product reliability. What is the impact of high and low temperature test on the product? View >>

Date：2022-06-01 14:43:55

With the continuous development of material technology, component technology and electronic design technology, the functions of electronic products are becoming more and more complex and integrated, which also puts forward higher requirements for the reliability of electronic products. Improving the reliability of products and making them give full play to their best performance is the key factor to improve the quality of an electronic product, and it also directly affects the evaluation of end users. Improving the reliability of electronic products is an extremely important and challenging task. In a sense, improving the reliability of products also improves the core competitiveness of products. The embodiment of scientific and technological progress is the upgrading of product quality and the improvement of reliability. View >>

Date：2022-05-31 15:45:00

What is lead-free solder? Common lead-free solder component Zn can reduce the melting point of Sn. If Zn increases by more than 9%, the melting point will rise, and Bi will reduce Sn Zn, but with the increase of Bi, its brittleness will also increase. Zn can reduce the melting point of Sn. If Zn increases by more than 9%, the melting point will rise, and Bi will reduce Sn Zn, but with the increase of Bi, its brittleness will also increase. This kind of solder is the most commonly used lead-free solder at present. Its performance is relatively stable, and the characteristics of various welding parameters are close to those of lead solder. Although in can reduce the liquidus and solidus of Sn alloy, it has defects such as heat fatigue resistance, ductility, alloy brittleness and poor workability, so this formula is rarely used at present. View >>

Date：2022-05-31 15:37:19

Visual inspection system refers to the inspection of product appearance defects. It uses advanced machine vision inspection technology to detect the stains, scratches, spots, bumps, holes, folds, defects, bubbles and other defects on the workpiece surface. In the field of industrial automation, visual appearance inspection is the core part. Visual appearance inspection technology has played an important role in object recognition, bar code recognition, product quality inspection and appearance dimension measurement, so its application range is also very wide. The following is a brief introduction to several common application scenarios. View >>

Date：2022-05-31 15:30:41

With the rapid development of the electronic information industry, micro spacing devices have developed with higher and higher assembly density, and new SMT and MCM technologies have been born. The solder joints in microelectronic devices are becoming smaller and smaller, but the mechanical, electrical and thermodynamic loads they carry are becoming heavier and heavier, and the requirements for reliability are increasing. SMT packaging technology, new chip size packaging (CSP), solder ball array (BGA) and other packaging technologies widely used in electronic packaging require that electrical and rigid mechanical connections between different materials (mainly bearing shear strain) be directly realized through solder joints. Its quality and reliability determine the quality of electronic products. View >>

Date：2022-05-31 15:27:31

Product surface defect detection is a kind of machine vision technology, which uses machine vision to simulate the function of human vision, and carries out image acquisition, processing, calculation, and finally actual detection, control and application from specific objects. Today's consumer electronics consumers are looking forward to seeing flawless products out of the box. Products with scratches, bumps and other defects can result in costly returns and may damage the brand reputation and future business. View >>

Date：2022-05-30 14:43:03

What is environmental reliability testing? Environmental reliability refers to the ability of a product to complete specified functions within specified time under specified conditions. In the process of design and application, the product is constantly affected by its own and external climatic environment and mechanical environment. It needs to be able to work normally and needs to be verified with test equipment. It covers the application fields of electronics, automobile, rail transit, universe, ships, household appliances, information technology equipment, photovoltaic and so on. View >>

Date：2022-05-30 14:38:32

Chip reliability test is mainly divided into two major items: environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, outgoing line tensile strength test and outgoing line bending test), outgoing line weldability test, temperature test (low temperature, high temperature and temperature alternating test), damp heat test (constant humidity and alternating damp heat) Special tests (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be selected. View >>