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What are the magnetic particle inspection methods? Scope of application of magnetic particle inspection?

Date:2022-11-09 15:07:18

Magnetic particle testing is a method of observing defects with magnetic particle as the display medium. According to the type of magnetic powder medium applied during magnetization, the testing methods are divided into wet method and dry method; According to the time of applying magnetic powder to the workpiece, the inspection methods are divided into continuous method and remanence method. View >>

What are the common testing methods for electrolytic capacitors? Component testing organization

Date:2022-11-08 14:40:22

Electrolytic capacitor is a kind of capacitor. The metal foil is the positive pole (aluminum or tantalum). The oxide film (aluminum oxide or tantalum pentoxide) that is close to the metal with the positive pole is the dielectric. The cathode consists of conductive materials, electrolyte (electrolyte can be liquid or solid) and other materials. Since the electrolyte is the main part of the cathode, the electrolytic capacitor gets its name. At the same time, the positive and negative of the electrolytic capacitor must not be connected incorrectly. Aluminum electrolytic capacitors can be divided into four categories: lead type aluminum electrolytic capacitors; Horn type aluminum electrolytic capacitor; Bolt type aluminum electrolytic capacitor; Solid aluminum electrolytic capacitor. This paper collects and sorts out some materials, hoping to be of great reference value to all readers. View >>

What is the main purpose of metallographic analysis? 1. Learn about metal material slicing

Date:2022-11-08 14:36:34

Slicing technology, also known as section or metallographic section or microsection (English name: Cross section, X-section), is the most commonly used sample preparation and analysis method to observe the cross-sectional structure of samples. Slice analysis technology is one of the most common and important analysis methods in PCB/PCBA, parts and other manufacturing industries. It is usually used to determine the quality of work and analyze quality anomalies, inspect the quality of circuit boards, detect PCBA welding quality, find the causes and solutions of failure, and evaluate process improvement as the basis for objective inspection, research and judgment. View >>

Sharing of sample selection methods for metallographic analysis

Date:2022-11-07 16:28:00

The sample selection is the first step of metallographic analysis. The quality of sample selection directly determines the quality of the experimental results, and its importance is beyond doubt. Metallographic analysis is one of the important means of metal material test and research. Based on the principle of quantitative metallography, the three-dimensional spatial morphology of the alloy structure is determined by the measurement and calculation of the metallographic microstructure of the two-dimensional metallographic sample grinding surface or film, so as to establish the quantitative relationship between the alloy composition, structure and properties. View >>

Several Mosaic Methods of Metallographic Specimens

Date:2022-11-07 16:00:00

Metallographic sample inlay (also known as inlay) refers to the need to inlay or clamp when the size of the sample is too small or the shape is irregular, which makes it difficult to grind and polish, so that the sample can be polished easily, and the work efficiency and accuracy of the experiment can be improved. The inlay is generally divided into three types: cold inlay, hot inlay and mechanical clamping. The samples to be inlaid are as follows: View >>

Introduction of commonly used methods for measuring the depth of decarburized layer

Date:2022-11-04 14:30:00

Decarburization is the phenomenon that all or part of the carbon on the steel surface is lost due to the oxidation atmosphere during the heating or insulation process of various hot working procedures. The depth of decarburized layer refers to the distance from the surface of decarburized layer to the matrix of decarburized layer where the difference in metallographic structure can no longer be distinguished. The following is a brief analysis of the decarburization layer depth testing method for your reference. View >>

How to grind the metallographic specimen? Detailed step process

Date:2022-11-04 14:08:00

To correctly inspect and analyze the microstructure of metals, excellent metallographic samples must be available. The prepared sample shall be able to observe the real structure, without abrasion marks, pitting and water marks, and keep the inclusions, graphite, etc. in the metal structure from falling off. Otherwise, the correctness of microscopic analysis will be seriously affected. The preparation of metallographic samples includes several steps, such as sampling, grinding, polishing, and microstructure display (etching). View >>

Summary of problems in X-ray weld inspection of electronic components

Date:2022-10-28 16:15:02

With the progress of science and technology, the circuit board is filled with smaller and smaller components, and the solder joint detection is also required to ensure the normal operation of the circuit board when welding is carried out by machine or manual. X-ray makes use of the penetrability of X-rays. Because of its short wave length and large energy, it can easily penetrate the tested materials. When the X-rays penetrate materials and do not penetrate materials to form differences, the materials with different densities can be distinguished by using the property of differential absorption. View >>

What are the contents of chip testing? IC Chip Reliability Test Standard

Date:2022-10-28 16:13:28

Chips play a similar role to human organs in various electronic devices. In order to achieve this level of reliability, testing and measurement play a vital role in the whole process of chip design and package testing. While semiconductor manufacturing plants accurately control each process parameter of the chip, they will also test at each stage of production to eliminate defective parts as soon as possible. Next, we will briefly introduce the IC chip reliability test, let's have a look! View >>

How to choose the appropriate burning mode for different chip models?

Date:2022-10-27 11:00:00

Chip burning refers to the chip brushing software, also known as firmware. Generally, the goods delivered by the original factory have not been burned, but they have certain codes in essence. The process of "transporting" the program to the internal memory space of the chip is called burning, and the burning methods are generally divided into offline burning and online burning. Different burning methods will affect the production process of the factory, the design of tooling and fixtures, etc. How to choose the appropriate burning mode for different chip models? View >>

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