Date：2022-12-02 15:14:25

From the development history of the chip, the development direction of the chip is high speed, high frequency and low power consumption. The chip manufacturing process mainly includes chip design, chip manufacturing, packaging manufacturing, cost testing and other aspects, among which the chip manufacturing process is particularly complex. Let's take a look at the chip manufacturing process, especially the chip manufacturing process. View >>

Date：2022-12-01 15:34:43

High temperature and high humidity test is to simulate the temperature and humidity environment in which products are stored and operated, and to check whether the impact on products after a period of time under this environment is within the acceptable range. The product storage and working environment has a certain temperature and humidity, and some environments have high temperature and humidity. The performance and service life of the product will be affected to some extent if the product is in such a high temperature and humidity environment for a long time. Therefore, the product needs to be tested at high temperature and high humidity to understand its performance. If it fails to meet the requirements, the product needs to be improved accordingly. View >>

Date：2022-11-30 15:28:00

In the production and manufacturing process of PCB circuit boards and components, it is particularly important to improve the production efficiency and yield rate of chip processing. It can reduce the production of finished products for enterprises and improve the economic benefits of enterprises. The purpose of aging test is to use laboratory equipment to simulate the change of insulation performance of insulating materials under long-term operation in the shortest time. Therefore, scientists from foreign experimental research departments have done a lot of research and experimental exploration, and finally determined the experimental method of simulated accelerated aging of insulating materials. View >>

Date：2022-11-30 15:25:28

X-ray detection technology is a new process method and analysis technology, which can complete the product defect detection that cannot be seen by the naked eye, and achieve 100% nondestructive testing, that is, it can accurately detect the internal problems of the product without causing any damage to the product. X-ray detection, with its unique advantages, has successfully attracted the attention of various industrial industries and is widely used in production lines. X-ray detection equipment is a detection method that uses low-energy X-ray to quickly detect the internal quality and foreign matters of the object to be detected, and displays the image of the object to be detected through the computer. View >>

Date：2022-11-29 16:08:56

Optoelectronic devices are various functional devices made of photoelectric conversion effect, which can realize the functions of optical signal generation, signal modulation, detection, connection, energy division and combination, energy increase and decrease, signal amplification, photoelectric conversion, electro-optic conversion, etc. Optoelectronic devices are the key and core components of optoelectronic technology, and the detection of optoelectronic components in various industries is an essential basic work. There are many kinds of products that need to be tested for reliability, and the testing needs of each industry are different. Different methods must be used according to different components to determine whether the components are normal or not. What about the reliability test of optoelectronic components? Next, let's have a look. View >>

Date：2022-11-29 16:05:32

The outstanding feature of nondestructive testing is that it can be tested without damaging materials, workpieces and structures. Therefore, after nondestructive testing, the inspection rate of products can be very high. X-ray flaw detection and ultrasonic flaw detection are both nondestructive testing methods of nondestructive testing, and many people will ask what is the difference between x-ray flaw detection and ultrasonic flaw detection? In order to help you understand, the following contents are organized by the Core Creation Testing Network for your reference. View >>

Date：2022-11-28 15:33:20

Components and parts shall be screened according to relevant screening technical conditions and can only be used after being qualified. In order to prevent false soldering caused by oxidation of welding end after chip component screening, chip component screening shall not be conducted without conditions for solderability treatment of welding end. In order to help you understand deeply, this paper will summarize the knowledge related to the specification, standard and purpose of secondary screening of components. If you are interested in the content to be covered in this article, please read on. View >>

Date：2022-11-28 15:31:00

EMC, in Chinese, refers to the ability of the equipment or system to meet the requirements in its electromagnetic environment and not cause unbearable electromagnetic interference to any equipment in its environment. EMC test, also known as electromagnetic compatibility (EMC), refers to the comprehensive evaluation of electromagnetic interference (EMI) and anti-interference capability (EMS) of electronic products, and is one of the most important indicators of product quality. View >>

Date：2022-11-25 16:32:05

Salt spray test is an environmental test that mainly uses artificial simulated salt spray environmental conditions created by salt spray test equipment to assess the corrosion resistance of products or metal materials. It is divided into two categories, one is natural environmental exposure test, the other is artificial accelerated simulated salt spray environmental test. The artificial simulated salt spray environment test is to use a kind of test equipment with a certain volume space - salt spray test chamber, and use manual methods in its volume space to create a salt spray environment to assess the quality of salt spray corrosion resistance of products. View >>

Date：2022-11-25 16:16:57

Electronic components shall be selected according to the electrical performance, reliability and manufacturability requirements of the product, and the types, dimensions and packaging forms of components shall be selected. Conventional components shall be selected as far as possible. Ensure that the electronic components meet the requirements of design documents and process documents, and the components and printed circuit boards selected for assembly shall be compatible with the characteristics of the process materials used in the assembly process. View >>