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EMC testing and certification of electromagnetic compatibility

Date:2022-12-12 16:17:00

1、 In the field of electromagnetic compatibility (EMC), why is it always described in decibels (dB)? Answer: Because the range of amplitude and frequency to be described is very wide, it is easier to express it in logarithmic coordinates on the graph, and dB is the unit when expressed in logarithm. View >>

Transcript of the seminar on Chip Genuine and Fake Detection and Domestic Alternative Testing Scheme of Creative Core Testing: close to reality with cases to help build a credible "core" ecosystem

Date:2022-12-09 15:45:00

In recent years, the macro environment has been changeable, and the epidemic has repeatedly affected the domestic electronic industry chain. The continuous fermentation of the "core shortage tide" has brought difficulties to the supply of materials in the market, and has also indirectly promoted the proliferation of fakes, seriously endangering the normal supply chain order. Driven by the market demand, domestic chips are increasingly replacing the original position of imported chips by virtue of their excellent cost performance ratio and localization services. However, the majority of terminals still need professional solutions to deal with the selection, testing, development and other problems of alternative solutions. View >>

Reliability screening of semiconductor devices for quality inspection of electronic products

Date:2022-12-09 14:41:06

With the development of electronic technology, the number of electronic components used in equipment is gradually increasing, and the reliability of electronic components is also put forward higher and higher requirements. Electronic components are the basis of electronic equipment and the basic resources to ensure the high reliability of electronic equipment. Their reliability directly affects the full play of the working efficiency of equipment. In order to help you understand, the following contents are organized by the Core Creation Testing Network for your reference. View >>

Analysis of Six Common Causes of MOSFET Tube Failure

Date:2022-12-09 14:40:55

MOS tubes are metal oxide semiconductor field effect transistors, or metal insulator semiconductor. The source and drain of MOS tube can be exchanged. They are both N-type regions formed in the P-type background. To correctly test and judge whether MOSFET fails, the key is to find the reason behind the failure and avoid making the same mistake again. This paper has collected and sorted out some data, hoping to be of great reference value to all readers. View >>

What is REACH test? What does REACH mainly test?

Date:2022-12-08 14:51:05

REACH test is the EU market regulation on the registration, evaluation, licensing and restriction of chemicals; Use and content of toxic and harmful substances restricted in REACH regulations. It is the abbreviation of the European Union Regulation "Registration, Evaluation, Authorization and Restriction of Chemicals", a chemical regulatory system established by the European Union and implemented since June 1, 2007. View >>

Rectification skills and precautions for EMC electromagnetic compatibility testing

Date:2022-12-08 14:51:00

The full name of EMC test (electromagnetic compatibility test) is Electro Magnetic Compatibility, which is defined as the ability of equipment and systems to work normally in their electromagnetic environment without causing unbearable electromagnetic interference to anything in the environment. Therefore, the EMC test includes two requirements: on the one hand, the electromagnetic interference generated by the equipment to the environment during normal operation cannot exceed a certain limit; On the other hand, it means that the appliance has a certain degree of immunity to electromagnetic interference existing in the environment, that is, electromagnetic sensitivity. View >>

Electronic soldering technology Precautions for manual soldering of circuit boards

Date:2022-12-07 16:29:14

In the production of electronic products in the electronic industry, the joints of components need to be welded with solder wire, and the quality of welding has a great impact on the quality of production. In order to ensure a better application effect, the tin wire is usually welded manually later. In order to enhance your understanding of the manual soldering of circuit boards, the following is a small compilation of electronic soldering technology related content, hoping to give you reference and help. View >>

EU ROHS Certification Test Purpose and Project Scope

Date:2022-12-06 16:09:46

RoHS certification is a mandatory standard formulated by EU legislation. Its full name is the Restriction of Hazardous Substances, which has been officially implemented since July 1, 2006. It is mainly used to regulate the material and process standards of electronic and electrical products, making them more conducive to human health and environmental protection. View >>

Basic process of coating/plating failure analysis and detection

Date:2022-12-06 16:08:42

With the development trend of production and technology, coating/coating raw materials have gradually appeared in our sight and rapidly developed throughout people's daily life. In general, the general development trend of the technology of raw materials for coating/coating in the future is to achieve excellent performance, high functionality, intelligent systems and environmental protection. According to a series of analysis and certification methods of failure analysis, the direct cause and principle of its invalidity can be searched, which has a key practical significance in improving product quality, processing technology improvement, compulsory litigation and other fields. View >>

What equipment is required for chip testing? Main methods of chip function test

Date:2022-12-02 15:14:58

In recent years, the demand of semiconductor equipment market in Chinese Mainland has grown rapidly. In this context, the high-precision detection equipment that must be used for chip wafer detection also has an increasingly broad market. Because each functional component has its own test requirements, the design engineer must make a test plan at the beginning of the design. This paper collects and sorts out some materials, hoping to be of great reference value to all readers. View >>

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