Date：2022-12-19 15:41:16

Reliability is a branch of quality control. However, it is a necessary stage for products to continuously pursue reliability as a specialized technology. The two main contents of reliability research are failure analysis and reliability testing (including destructive experiments). Both of them influence and restrict each other. Therefore, we must attach importance to and accelerate the development of reliability analysis of components, determine the failure mechanism through analysis, find out the cause of failure, feed back to the design, manufacturing and use, and jointly study and implement corrective measures to improve the reliability of electronic components. View >>

Date：2022-12-16 14:38:40

Electronic components mainly include components and devices. Electronic components are finished products whose molecular components are not changed during production and processing, such as capacitors, resistors and inductors. Electronic devices are finished products whose molecular structure changes during the production process, such as electronic tubes, integrated circuits, etc. In order to help you understand deeply, this paper will summarize the relevant knowledge about the failure causes of various electronic components. If you are interested in the content to be covered in this article, please read on. View >>

Date：2022-12-16 14:38:26

Internal audit is a systematic and regular audit of the compliance, suitability and effectiveness of the system operation to ensure the self improvement and continuous improvement of the management system. The management review is the formal evaluation of the current situation and adaptability of the quality system by the top management of the laboratory on the quality policy and objectives. View >>

Date：2022-12-15 14:03:17

There are many common welding defects of circuit boards, and these factors may cause some dangers to the circuit boards. The common welding defects, appearance characteristics, hazards, and cause analysis are described in detail below. If you are interested in the content to be covered in this article, please read on. View >>

Date：2022-12-15 13:54:29

Electronic components are an indispensable part of aerospace products and one of the important technical bases for improving their performance and reliability. The development of aerospace industry tells us that the performance, quality and reliability of electronic components are one of the key factors for the success of aerospace products. This paper collects and sorts out some materials, hoping to be of great reference value to all readers. View >>

Date：2022-12-14 15:14:14

FMEA is a systematic activity in the product design stage and the process design stage, which analyzes the subsystems and parts constituting the product and each process constituting the process one by one, finds out all potential failure modes, and analyzes their possible consequences, so as to take necessary measures in advance to improve the quality and reliability of the product. In order to enhance everyone's understanding of the product failure analysis FMEA, the following are the relevant contents of the failure analysis FMEA project organized by the small group, hoping to bring you reference and help. View >>

Date：2022-12-14 15:10:36

Problems and risks of laboratory instruments and equipment 1. Instruments and equipment that affect each other are placed together, interfere with each other, and the data is inaccurate. 2. Instruments and equipment are not calibrated/verified for a long time, and the accuracy is not guaranteed. 3. The instruments and equipment are not checked during the period, and the performance is not controlled. 4. Instruments and equipment have no status identification or the identification is confused, which is easy to be misused. View >>

Date：2022-12-13 16:39:06

In the actual processing process, PCBA solder joint failure is also encountered. On the one hand, solder joint failure comes from welding failures in production and assembly, such as solder bridging, faulty welding, Manhattan phenomenon, etc; On the other hand, under service conditions, when the ambient temperature changes, due to the difference in thermal expansion coefficient between components and substrate materials, thermal stress is generated in the solder joint. Periodic changes in stress will cause fatigue damage to the solder joint. At the same time, compared with the temperature of the service environment, the melting point of SnPb solder is low. With the time going on, obvious viscosity behavior will occur, leading to variable damage to the solder joint. It is necessary to analyze and find out the cause to avoid the solder joint failure again. So today, let's introduce the main factors of PCB solder joint failure analysis. View >>

Date：2022-12-13 16:37:16

Laboratory accidents occur frequently, and the laboratory safety alarm bell must ring constantly. In order to prevent major safety accidents, it is necessary to improve the emergency management mechanism, which can quickly and effectively control and handle possible accidents, protect personal safety and property safety, and ensure the safety and normal operation of the laboratory. In order to help you understand, the following contents are organized by the Core Creation Testing Network for your reference. View >>

Date：2022-12-12 16:22:18

Want to know what is certification, approval, inspection and testing? Certification and accreditation inspection and testing are collectively referred to as conformity assessment in the world. It is an internationally accepted basic rule. Its essential attribute is "delivering trust and serving development", which is characterized by marketization and internationalization. It is called the "medical certificate" of quality management, the "letter of credit" of market economy, and the "passport" of international trade. This paper collects and sorts out some materials, hoping to be of great reference value to all readers. View >>