Date：2023-02-02 16:00:00

The core of electronic equipment is the circuit board, which is welded and assembled by various types of electronic components. If the equipment fails or has a short circuit, most of the reasons will be caused by the failure or damage of electronic components. Therefore, how to correctly detect electronic components is particularly important, which is also a skill that electronic maintenance personnel must master. Here are some common electronic component detection techniques for your reference. View >>

Date：2023-02-01 18:15:38

The detection of optoelectronic components is an essential basic work. How to accurately and effectively detect the relevant parameters of components and determine whether the components are normal depends on different methods to determine whether the components are normal. Among them, there are many types of products that need to be tested for reliability, and different enterprises will have different testing requirements according to different requirements. This article has collected and collated some materials, hoping to be of great reference value to all readers. View >>

Date：2023-02-01 18:12:56

X-ray detection technology is a non-contact detection technology, which has the characteristics of strong penetration, large detection depth, high detection quality, fast detection, accuracy and reliability. It can quickly and accurately detect the shape, structure and defects inside the object, so that the defects in the SMT process can be found and eliminated in time, thus effectively improving the product quality. This article has collected and collated some materials, hoping to be of great reference value to all readers. View >>

Date：2023-01-31 18:15:04

According to the official website of the State Administration of Market Supervision, the State Administration of Market Supervision issued a reply to the Recommendation No. 8893 of the Fifth Session of the 13th National People's Congress on Promoting the Transformation of Certification and Accreditation Inspection and Testing Institutions into Non-profit Legal Persons. The full text is as follows: View >>

Date：2023-01-13 11:40:16

At present, the requirements for product quality and reliability are increasing, and the work of failure analysis has become more and more important. Through the chip failure analysis, we can find out the defects in integrated circuits, abnormal parameters or improper design and operation. The purpose of failure analysis is to determine the failure mode and failure mechanism, and propose corrective measures to prevent the recurrence of such failure mode or failure mechanism, thus affecting our normal application and production. View >>

Date：2023-01-13 11:40:06

In PCBA processing, there are two processing methods for plug-in materials: selective wave soldering and manual soldering. In the electronic product manufacturing enterprises that pursue efficiency, wave soldering is generally used for most of them. There are also some solder joints that can not be welded by wave soldering, which can only be combined with wave soldering and manual soldering. Which is better, selective wave soldering or manual soldering? What are the differences? To help you understand, the following content is organized by Chuangxin Testing Network for your reference. View >>

Date：2023-01-12 15:22:34

The tin spraying process is a process of spraying tin on PCB and blowing it flat with hot air. It has excellent solderability. There are two kinds of tin spraying processes: lead tin spraying and lead-free tin spraying. To help you understand in depth, this article will summarize the relevant knowledge of tin spraying. If you are interested in the content to be covered in this article, please read on. View >>

Date：2023-01-12 15:22:00

X-Ray detection equipment is an effective tool for checking the reliability of chip packaging. It can detect the defects inside the chip packaging to ensure the reliability of chip packaging. In order to improve the packaging quality of products, it is necessary to use X-RAY nondestructive testing equipment to carry out chip packaging testing to maximize the control of inferior products and waste products. This paper will introduce the application of X-ray detection equipment in ensuring the reliability of chip packaging. View >>

Date：2023-01-11 15:30:17

Wave soldering can be divided into single wave soldering and double wave soldering. The soldering surface of the PCB circuit board is directly contacted with the high-temperature liquid tin, so as to achieve the purpose of welding technical requirements. The high-temperature liquid tin is kept in an inclined plane. The liquid tin is formed by a special device to form similar waves, which is mainly made of solder strips. Wave soldering process flow: fixture installation → spray flux system → preheating → primary wave peak → secondary wave peak → cooling, and then the core detection will come to communicate with you the key points of the wave soldering process operation of solder bar. View >>

Date：2023-01-11 15:25:00

There are various methods to analyze the chemical composition of substances. When it is necessary to test the chemical composition of substances for research or other reasons, professional inspection institutions will use professional means and instruments to analyze. Therefore, the standard stipulates the chemical composition that must be guaranteed for most metal materials, and some even serve as the main quality and variety indicators. Chemical composition can be analyzed and identified by chemical and physical methods. At present, chemical analysis and spectral analysis are the most widely used methods. In addition, the spark identification method with simple equipment and fast identification speed is also a practical and simple method for steel composition identification. View >>