Login | Join Free

Hotline

4008-655-800
行业资讯
What are the inspection principles and requirements for IC appearance inspection?

Date:2023-03-22 15:12:34

IC appearance detection is a process of detecting the external characteristics, markings, dimensions, etc. of a chip, and is also an important means to ensure IC quality and performance. Manual inspection and automated inspection have their respective advantages and disadvantages, and appropriate methods are selected for IC appearance inspection based on specific needs. To help you gain an in-depth understanding, the following content is organized by Chuangxin Testing Network for your reference. View >>

What are the aspects of a formal failure analysis?

Date:2023-03-22 15:10:49

Formal Failure Analysis is a comprehensive analysis and testing of a product or system to determine its failure causes and factors that may lead to failure, and to take appropriate measures to avoid or reduce the occurrence of failure events. Formal failure analysis can be used at product design, manufacturing, and maintenance stages to ensure product quality and reliability. In this article, I will introduce several aspects of formal failure analysis and explore its application in the electronic component industry. To help you gain an in-depth understanding, the following content is organized by Chuangxin Testing Network for your reference. View >>

What aspects of Fmea failure analysis are used?

Date:2023-03-22 15:08:35

FMEA (Failure Mode and Effects Analysis) is a common risk management tool that can be used to identify and evaluate possible failure modes and their impact on systems, equipment, or products, as well as develop corresponding corrective and preventive measures to reduce potential risks and losses. Common items available for FMEA failure mode analysis include: production management; Equipment application; Process management; Engineering management; Welding technology; System control and operation; Frequency; physical distribution management; Software analysis; Injection molding; Machining; Printing; PCB; Heating system, etc. View >>

What is the process of IC appearance defect detection scheme for chip defect detection?

Date:2023-03-22 15:06:59

Appearance defect detection of electronic components is very important because these products are usually small in size and have high quality requirements, making it difficult to pass manual batch testing. At the same time, due to the small size and high accuracy of chips, appearance testing has always been a pain point in the industry, and still requires a lot of manual testing. In order to enhance everyone's understanding of chip defect detection, the following is the relevant content of the IC appearance defect detection scheme process compiled by the editor, hoping to provide you with reference and assistance. View >>

Application Fields and Test Standards of High and Low Temperature Alternating Humidity Heat Test

Date:2023-03-21 17:52:00

High and low temperature alternating humidity and heat test refers to the adaptability test of products during storage, transportation, and use under simulated test conditions in different environments such as high temperature, low humidity, low temperature, and high humidity. It is a widely used test project in the application field. It is mainly used to test and determine the state and various performance parameters of electrical, electronic, and other products and materials after undergoing high temperature, low temperature, alternating humidity, or constant test temperature environment changes. This article has collected and collated some materials, hoping to have greater reference value for readers. View >>

Main Purpose and Common Methods of Insulation Resistance Test

Date:2023-03-20 09:00:00

Electrical equipment usually uses non-conductive insulating fiber products, mica, insulating oil, asphalt, glass, ceramics, polymer materials, etc. as insulating materials. The basic principle of insulation resistance meter testing is to apply a test voltage between the independent circuits under test and detect the leakage current of the circuit to obtain the insulation resistance value. This article has collected and collated some materials, hoping to have greater reference value for readers. View >>

What is non-destructive testing? Scope of application of non-destructive testing methods

Date:2023-03-17 14:40:38

Non destructive testing (NDT) is the use of optical, electrical, acoustic, magnetic, and other characteristics to detect whether there are defects in the tested object without damaging its integrity and usability, and can accurately provide information about the specific location, size, quantity, and nature of the defects. It is an indispensable technical means for the development of modern industry. With modern technology and equipment, the structure, properties, status, and defect types of the interior and surface of the test piece are analyzed The method of inspecting and testing the nature, quantity, shape, location, size, distribution, and changes thereof. View >>

How to do composition analysis? What is the scope of testing products?

Date:2023-03-16 17:33:45

The definition of component analysis is to analyze the sample through modern analysis and separation methods, and obtain the qualitative and quantitative results of the components in the corresponding products after the comprehensive verification of the analyzed atlas. Such a process is called component analysis. How to do composition analysis? What is the scope of testing products? To help you understand, the following content is organized by Chuangxin Testing Network for your reference. View >>

What is ultrasonic inspection? Difference between X-ray and ultrasonic testing

Date:2023-03-15 16:04:59

Ultrasonic testing is abbreviated as UT, also known as ultrasonic testing. It uses ultrasonic technology for testing, and is one of five conventional nondestructive testing methods. Common flaw detection methods for flaw detection test include: X-ray flaw detection, ultrasonic flaw detection, magnetic particle flaw detection, penetrant flaw detection (dye flaw detection), eddy current flaw detection γ Radiographic inspection, fluorescent inspection and other methods. To help you understand, the following content is organized by Chuangxin Testing Network for your reference. View >>

Process and precautions of component analysis and detection

Date:2023-03-15 16:02:22

Composition analysis plays a very important role in the production process. As long as we can understand the composition and content of materials, we can understand the performance of products, so as to carry out quality monitoring. In addition, composition analysis can also help us find the cause of product performance decline, solve the problems in the production process, quickly find the cause of unknown objects and eliminate hidden dangers, improve product formula, imitate production, etc. This article has collected and collated some materials, hoping to be of great reference value to all readers. View >>

First « 1 2 53 54 55 56 57 151 152 » Last
Baidu
map