Date：2023-06-08 16:18:38

In the production and testing of integrated circuits, it is often necessary to open the IC cover for observation of the internal structure of the chip and maintenance of components. Opening a cover refers to the operation of replacing or adding components to an integrated circuit chip (IC), which usually requires the use of special tools and potions. When opening the cover, caution is necessary to ensure the safety and integrity of the chip. This article will introduce two aspects: what kind of potion to use for IC capping and the identification of chip capping model. View >>

Date：2023-06-08 16:18:28

In order to effectively extend the service life of composite materials, it is necessary to analyze and handle the failure of composite materials. The failure modes of composite materials are relatively complex, and common failure modes include ductile failure, creep failure, and stable failure. The following will introduce the characteristics and applications of these three failure modes. View >>

Date：2023-06-08 16:18:19

With the continuous development of modern technology, electronic components are increasingly widely used in our daily lives, and the requirements for their quality have become increasingly high. To ensure the reliability and safety of electronic products, it is crucial to analyze the surface composition of electronic components. As an independent testing institution, third-party testing centers can provide surface composition analysis services for electronic components, helping customers ensure product quality and safety. View >>

Date：2023-06-02 16:51:28

Composite materials are one of the most widely used engineering materials in the field of modern engineering, with advantages such as high strength, light weight, corrosion resistance, and wear resistance. But there are also some problems during use, such as the failure phenomenon of composite materials. In order to identify and solve failure problems, it is necessary to analyze the failure phenomena of composite materials. If you are interested in the upcoming content, please continue reading the following text, hoping it can be helpful to you. View >>

Date：2023-06-02 16:48:06

Reliability is a very important concept in the field of electronic equipment and device engineering, which refers to the ability of a device or device to maintain its performance and functionality within a specified service life. Reliability analysis can help evaluate the lifespan of machines under specific environmental and operating conditions, and help predict the probability of failure occurrence, thereby guiding how to optimize the design and manufacturing process of equipment. DPA (Constructive Physical Analysis) analysis is an important testing technique in reliability testing, which can help verify the reliability of chips. View >>

Date：2023-06-01 16:45:49

Composite materials are materials formed by the organic combination of two or more materials with different properties, and their combined performance exceeds the single performance of the raw material. It is widely used in fields such as aerospace, automotive manufacturing, shipbuilding, sports goods, and architecture. In order to better extend the service life of composite materials, it is necessary to analyze and handle the failure of composite materials. This article will introduce the methods and means of composite material failure analysis. View >>

Date：2023-06-01 16:45:41

The component chemical composition analysis project refers to the process of qualitative and quantitative analysis of materials and elements in components using chemical analysis methods. What are the requirements for component chemical composition analysis projects? To help everyone gain a deeper understanding, the following content is organized by Chuangxin Testing Network and provided for your reference. View >>

Date：2023-05-31 15:17:46

Component analysis refers to the method of conducting chemical analysis on the substance to be tested to determine the types and contents of elements, compounds, or molecules contained in the substance. The method of component analysis involves various types and ranges, and this article will provide a detailed introduction to these contents. View >>

Date：2023-05-31 15:17:36

Electronic component failure refers to various faults that occur during the use of components, such as performance degradation, changes in electrical parameters, short circuits, etc. These faults can lead to circuit instability and a decrease in work efficiency. In order to accurately analyze the causes of component failures and improve the reliability and stability of circuits, chemical composition detection and analysis are required. View >>

Date：2023-05-31 15:17:28

Composite materials, as a high-performance material, also face various challenges during use, such as fatigue failure, corrosion failure, crack failure, and so on. In order to better use and manage composite materials, it is necessary to judge and evaluate these failure modes. This article will introduce the criteria for determining the failure forms of composite materials, including how to determine the failure of composite materials, the causes of failure, and how to evaluate the impact of failure. View >>