Date：2023-06-14 15:44:38

Non Destructive Testing (NDT) refers to a modern testing technique that detects, judges, evaluates, and identifies possible defects or changes in performance without damaging the tested material or component. Among them, PT (Penetrant Testing) testing is an important non-destructive testing method. It uses the principle of surface tension to adsorb liquid surface tension agent solutes onto the surface of the specimen, and detects defects such as cracks and small pores on the surface of the specimen through color reaction. It has high sensitivity, high reliability, and is easy to operate. View >>

Date：2023-06-13 15:13:00

Electronic components are becoming increasingly popular in our daily lives, and the soldering of electronic components is a crucial step in electronic assembly. Correct soldering methods and techniques are crucial for ensuring the reliability and stability of electronic products. Below is some information on tin welding methods and techniques. View >>

Date：2023-06-13 15:12:40

IC chips are essential core components in modern electronic technology, but they are also inevitably damaged. IC chip damage may lead to various malfunctions. If you are interested in the upcoming content, please continue reading the following text, hoping it can be helpful to you. View >>

Date：2023-06-13 15:12:04

Salt spray testing is a commonly used reliability testing method for electrical and electronic products, used to evaluate the tolerance and reliability of products in salt spray environments. Salt spray testing is usually used to verify the performance and stability of products in high temperature, high humidity, and salt spray environments. So, which products require salt spray testing? To help everyone gain a deeper understanding, the following content is organized by Chuangxin Testing Network and provided for your reference. View >>

Date：2023-06-12 16:13:53

IC chips are important products in the semiconductor industry, used in various electronic devices and systems, and their performance and reliability directly affect the performance and lifespan of electronic devices. In some special cases, it is necessary to meet the production requirements of chips through baking coordination. Below is an introduction to the conditions and requirements for baking IC chips. View >>

Date：2023-06-12 16:13:42

During the use of electrical and electronic products, they often need to work in high and low temperature environments, so the high and low temperature testing of electrical and electronic products is particularly important. High and low temperature testing can help products determine suitable usage environments, evaluate product performance under different temperature environments, and ensure product reliability and stability. The following is some information about high and low temperature testing of electrical and electronic products. View >>

Date：2023-06-12 16:13:33

In the process of manufacturing cars, conducting salt spray testing and salt water testing has become a standard testing process to ensure the durability and corrosion resistance of vehicles in harsh environments. Salt spray testing and salt water testing are commonly used methods for reliability testing of electrical and electronic products, but there are some differences in their principles, uses, and precautions. This article summarizes some materials and hopes to provide valuable references for readers. View >>

Date：2023-06-09 15:30:00

The difference in chip color after opening the IC cover is one of the concerns of many consumers when purchasing electronic products. With the continuous expansion of the IC market, some unscrupulous individuals have also begun to use counterfeit and inferior ICs to seek huge profits. Therefore, how to quickly distinguish the authenticity of ICs has become an urgent issue. In this article, we will delve into the color issue of IC chips after opening the cover, and how to quickly distinguish authenticity to avoid being deceived. View >>

Date：2023-06-09 15:29:36

Chip unsealing refers to the removal of chip packaging materials (such as epoxy resin, silicone, aluminum foil, etc.) that are encapsulated on the outer layer of a chip, thereby exposing the internal structure and circuits of the chip. Chip unpacking is usually carried out for quality testing, failure analysis, recycling, and other purposes. This article will provide a detailed introduction to the reasons for chip unsealing and the entire process. View >>

Date：2023-06-09 15:28:57

Due to the wide variety and complex parameters of IC chips, parameter detection and quality control of IC chips are very important. So, how do you know the parameters of an IC chip? The parameter detection of IC chips can be completed through third-party testing centers, and we will introduce it below. View >>