Date：2023-10-19 17:18:24

Scanning Electron Microscopy (SEM) is a high-resolution microscopy technique that uses signals generated by the interaction between an electron beam and a sample to observe the morphology, structure, and composition of the sample surface. This article will introduce the principles and applications of scanning electron microscopy. View >>

Date：2023-10-19 17:18:09

Moisture sensitive devices refer to electronic components packaged with hygroscopic materials such as epoxy resin, polymer resin, etc. Moisture sensitivity level (referred to as MSL in the electronics industry) is defined as the maximum safe time a component can be exposed to an environment not higher than 30 ° C and 60-85% relative humidity for reflow soldering processes. This range starts from MSL 1 and is referred to as "unrestricted" or unaffected, with each incremental level representing a duration threshold. View >>

Date：2023-10-18 16:54:23

The quality of solder joints is crucial for determining the reliability and performance of SMT components, and the quality of BGA solder joints should be crucial. Therefore, it is crucial to take effective measures to ensure the quality of BGA components' solder joints and achieve the ultimate reliability of SMT components. This article will introduce common methods for BGA welding quality inspection. View >>

Date：2023-10-18 16:54:12

DPA (Destructive Physical Analysis) detection of components is a method of determining the cause and mechanism of failure through physical analysis of components. In the manufacturing and maintenance process of electronic products, the failure of components may lead to the failure of the entire circuit, affecting the performance and reliability of the entire electronic product. Therefore, DPA detection of components is particularly important. View >>

Date：2023-10-17 14:42:50

BGA welding is a critical process in PCBA processing. However, due to the relative difficulty of inspection and maintenance after BGA welding, X-ray fluoroscopy must be used to ensure the reliability of the welding connection. Therefore, in PCBA processing, it is crucial to diagnose the defects in BGA welding, especially during reflow welding. This article will introduce the judgment method and handling of BGA welding defects. View >>

Date：2023-10-17 14:42:42

Structural analysis of electronic components is a method of analyzing the internal structure of components to determine whether their structure meets design requirements. When conducting structural analysis, special tools and techniques are needed to comprehensively understand the structure of components. The following is a detailed introduction to the structural analysis of electronic components. View >>

Date：2023-09-28 15:46:08

Electronic components are the core components of electronic products, and their quality and performance directly affect the quality and performance of products. To ensure the quality and reliability of electronic products, it is necessary to inspect and screen electronic components. This article will discuss this topic and introduce how to inspect and screen electronic components. View >>

Date：2023-09-28 15:45:58

Electronic components are an important component of modern electronic products, and their quality and reliability have a crucial impact on the performance and lifespan of products. In order to ensure the quality and reliability of electronic components, it is necessary to use some special testing equipment and techniques for testing. The following is a detailed introduction to electronic component testing equipment. View >>

Date：2023-09-27 14:27:10

IC chips are the core components in electronic products, and their quality and authenticity directly affect the performance and reliability of products. In China, there are various methods that can be used to identify the authenticity of IC chips. This article summarizes some information and hopes to provide valuable references for readers. View >>

Date：2023-09-27 14:26:16

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