Date：2024-01-24 16:19:34

The rapid temperature change humid heat experiment is used to confirm the adaptability of products to storage, transportation, and use in high temperature, low temperature, rapid or slow changing climate environments. The experimental process takes room temperature → low temperature → low temperature stay → high temperature → high temperature stay → room temperature as a cycle, and the severity of temperature cycling experiments is determined by the high/low temperature range, stay time, and number of cycles. The functional characteristics of the sample after temperature changes or continuous temperature changes in the environment, or the operational functionality in this environment. View >>

Date：2024-01-24 16:18:27

In order to ensure the quality and reliability of electronic and electrical products, various reliability tests are widely adopted. Among them, packaging drop test is an important part of electronic and electrical reliability testing. This article will introduce the significance and role of packaging drop testing, and explore the precautions to be taken when conducting this test. View >>

Date：2024-01-23 15:48:48

The tests conducted to evaluate and analyze the reliability of electronic products are called reliability tests. For different products, different reliability testing methods can be chosen to achieve different goals. Reliability testing, also known as product reliability assessment, refers to the ability of a product to complete specified functions under specified conditions and within a specified time. This article has collected and organized some materials, hoping to have significant reference value for readers. View >>

Date：2024-01-23 15:48:33

IC chip aging test refers to long-term stability testing of integrated circuit chips under specific conditions to verify their reliability and stability within their service life. Its main function is to evaluate the lifespan and performance of chips, in order to improve their quality and reliability. View >>

Date：2024-01-22 15:08:00

Reliability testing is crucial for the manufacturing and design process of chips. By conducting comprehensive and rigorous reliability testing, potential design defects, manufacturing issues, or environmental sensitivities can be identified and resolved in advance, ensuring the performance and reliability of chips in long-term use. This article has collected and organized some materials, hoping to have significant reference value for readers. View >>

Date：2024-01-22 15:07:52

Chips are a crucial component of modern electronic devices, widely used in various devices such as computers, mobile phones, tablets, and smart homes. Due to various reasons, the chip may malfunction or be damaged, which will result in the device not functioning properly. This article will explore the analysis of chip faults and damages, as well as how to detect and repair them. View >>

Date：2024-01-19 17:23:39

In the field of electronic engineering, component failure is a common occurrence. When components fail, it will have a serious impact on the performance and reliability of the entire electronic device. Therefore, conducting component failure analysis is very important. However, conducting effective failure analysis is not easy and requires consideration of many factors. This article will introduce three key issues to pay attention to when conducting component failure analysis, in order to help engineers better conduct failure analysis and improve the reliability and performance of electronic devices. View >>

Date：2024-01-19 17:23:31

BGA (Ball Grid Array) is a common packaging method for electronic components, and its welding quality directly affects the performance and reliability of electronic products. Virtual soldering is a common defect in BGA welding process, which can lead to poor contact between solder joints and pads, thereby affecting the electrical performance and mechanical strength of the product. This article will introduce the causes and control methods of BGA virtual soldering, helping readers better understand and solve related problems. View >>

Date：2024-01-18 13:50:55

Cold and hot shock testing, also known as temperature shock, heat shock testing, etc., simulates the testing of samples in environments with drastic temperature changes or alternating high and low temperatures. Electronic products often encounter temperature changes during use, such as rapid transitions between high and low temperatures and temperature changes. These temperature changes may have an impact on the performance and reliability of electronic products, so it is necessary to conduct cold and hot shock tests on electronic products. This article will introduce the principles and standard specifications of cold and hot shock in electronic products. View >>

Date：2024-01-18 13:50:43

BGA solder ball welding is a common connection method in electronic manufacturing, but adverse phenomena may occur during the welding process, which can affect the performance and reliability of electronic products. This article will introduce several common methods for determining the welding defects of BGA solder balls, to help readers better understand and solve related problems. View >>