Date：2024-04-03 11:44:54

Reflow soldering technology is a key link in the field of modern electronic manufacturing. Its basic principle is to melt the solder paste and form a solid connection with the solder pads and component pins by heating the pre coated solder pads on the circuit board and the installed electronic components, thereby completing welding. This article will provide a detailed analysis of the basic principles of various reflow soldering techniques and provide an introduction to their use. View >>

Date：2024-04-03 11:44:44

X-ray testing of electronic components is a non-destructive testing method that can detect internal defects and structural issues in electronic components. With the continuous improvement of electronic manufacturing technology, the packaging structure of electronic components is becoming smaller and the internal structure is becoming more complex. Traditional detection methods can no longer meet the requirements. Therefore, X-ray testing has become an indispensable part of the electronic manufacturing industry. View >>

Date：2024-04-02 16:47:00

A small component, from transportation, storage, to production line processes, ultimately being successfully installed on the machine is not as simple as imagined. There are important points to pay attention to in every aspect. If the failure of components causes the PCBA to malfunction, the troubleshooting work will be very cumbersome. Moreover, for general terminal manufacturers, even if a specific component issue is identified, due to limitations, it is not possible to thoroughly investigate its root cause. View >>

Date：2024-04-02 14:58:49

With the rapid development of semiconductor technology, ensuring the quality and reliability of chip products has become one of the key elements of industry development. Semiconductor internal visual inspection technology, as an important means of verifying chip quality, covers various advanced detection methods to discover and analyze subtle defects, abnormal connections, and other issues that may cause product failure in the internal structure of chips. The following are the main aspects of semiconductor internal visual inspection technology: View >>

Date：2024-04-02 14:58:38

Printed Circuit Board (PCB) is an indispensable component of electronic devices, and the quality of PCB has a significant impact on the performance and reliability of the entire electronic product. Due to the complexity and multi-layer structure of PCBs, conventional detection methods are difficult to detect their internal defects. Therefore, a non-destructive and high-precision detection method is needed, and X-ray detection equipment comes in handy. View >>

Date：2024-04-01 14:17:23

X-ray testing is commonly used to detect welding quality, including the quality of BGA (Ball Grid Array) welding. X-ray inspection can detect some welding defects, such as virtual welding, cold welding of solder joints, and misalignment of solder joints. Virtual welding refers to the situation where there is a gap or incomplete welding between the solder joint and the solder pad. X-ray testing can help detect such problems. Specifically, X-ray testing involves penetrating the welded joint with X-rays and capturing the X-ray image on the detector. If there are virtual welds or gaps, X-ray images usually show obvious defects, which can help quality inspectors determine whether the welding is qualified. View >>

Date：2024-04-01 14:17:01

The BGA (Ball Grid Array) chip is a commonly used electronic component, which has the characteristics of high density, high reliability, and high performance, and is therefore widely used in electronic products. Due to the difficulty in observing the internal structure and connection of BGA solder joints, non-destructive testing techniques are needed to evaluate their quality and reliability. View >>

Date：2024-03-29 10:41:10

Internal visual inspection of electronic components is an important part of the production process, which can effectively ensure the quality and performance of components, thereby ensuring the quality and reliability of electronic products. When conducting internal visual inspection of components, it is important to pay attention to some important matters to ensure the accuracy and effectiveness of the detection. Here are some precautions for internal visual inspection of electronic components. View >>

Date：2024-03-29 10:40:52

A testing report refers to a report prepared after testing, testing, and analyzing a product, substance, or service. In modern business environments, product quality is one of the key factors for enterprise success. In order to ensure that products meet relevant standards, meet consumer needs, and stand out in market competition, enterprises need to rely on various quality management methods, among which testing reports play a crucial role as an important component of quality assurance. View >>

Date：2024-03-28 16:37:12

The high and low temperature box has a wide temperature control range, and its performance indicators meet the technical conditions of the national standard GB/T10592 high and low temperature test box. It is suitable for conducting low temperature and high temperature tests on products in accordance with GB/T2423.1 and GB/T2423.1 and GB/T2423.2 Environmental Testing for Electrical and Electronic Products - Test A: Low Temperature Test Method, Test B: High Temperature Test Method. Suitable for high and low temperatures of electrical and electronic products (including components, equipment, and other products). View >>