Date：2021-04-27 16:04:37

The failure of semiconductor devices is usually due to the stress generated exceeding their maximum rating. Electrical stress, thermal stress, chemical stress, radiation stress, mechanical stress and other factors will cause device failure. Device failure will exist in the whole life cycle of the product. If there is no collection of failure information and failed devices in each stage, the failure analysis will lose the necessary "material" basis. Therefore, to carry out failure analysis, we must first establish the collection system of failure information and failed devices in the stages of development, production and engineering. The following is a summary and analysis of the five main reasons for the failure of semiconductor components! View >>

Date：2021-04-27 15:57:00

With the continuous improvement of people's requirements for product quality and reliability, failure analysis is becoming more and more important. In recent years, it has been popularized from military industry to ordinary enterprises. It is generally based on the failure mode and phenomenon, through analysis and verification, simulate and reproduce the failure phenomenon, find out the cause of failure, and dig out the failure mechanism. View >>

Date：2021-04-27 15:53:00

X-ray uses the cathode ray tube to produce high-energy electrons to collide with the metal target. In the process of impact, due to the sudden deceleration of electrons, the lost kinetic energy will be released in the form of X-ray. It is convenient to analyze the internal cracks and foreign matter defect detection of metal materials and parts, plastic materials and parts, electronic components, electronic components and LED components, as well as the internal displacement analysis of BGA and circuit board; Identify BGA welding defects such as empty welding and false welding, microelectronic system and adhesive sealing components, cables, fittings, internal conditions of plastic parts, etc. Counterfeit products appear in almost every industry. The problem of component counterfeiting is common, and has penetrated into the whole electronic component supply chain. Equipment manufacturers need to establish a strong defense system. View >>

Date：2021-04-27 15:35:00

Circuit failure is a headache for every engineer. During the use of electronic components, failures and faults will also occur, which will affect the normal operation of the equipment. Let's learn about the failure analysis and failure causes of electronic components. If you are familiar with the fault types of components, sometimes you can quickly find the fault components through intuition, and sometimes you can find the fault through simple resistance and voltage measurement. View >>

Date：2021-04-26 17:52:00

Diode is called crystal diode, which is a kind of semiconductor device, also known as semiconductor diode. The structure of crystal diode is a p-n junction structure formed by p-type nodule semiconductor and n-type nodule semiconductor. Respective space charge layers are formed on both sides of the nodule, and the equivalent of self built electric field is built. If there is no applied voltage, due to p-n  The diffusion current caused by the carrier concentration difference on both sides of the junction is equal to the drift current caused by the self built electric field. View >>

Date：2021-04-26 16:47:42

PCB circuit board is the foundation and highway of electronic components, also known as printed circuit board. It is the provider of electrical connection of electronic components. Its development has a history of more than 100 years; Its design is mainly layout design; The main advantage of using circuit board is to greatly reduce wiring and assembly errors, and improve the automation level and production labor rate. The quality of PCB is very important. To check the quality of PCB, a number of reliability tests must be carried out. This article is an introduction to testing. Let's have a look. View >>

Date：2021-04-26 16:41:00

Generally speaking, the failure of integrated circuits is inevitable in the process of development, production and use. With the continuous improvement of people's requirements for product quality and reliability, failure analysis is becoming more and more important. Chip failure analysis can help integrated circuit designers find design defects, mismatch of process parameters or improper design and operation. The common methods of chip failure analysis are no more than those processes. The most important thing is to rely on various advanced and accurate electronic instruments. The following contents are mainly elaborated from these two aspects, hoping to be helpful to you. View >>

Date：2021-04-26 16:36:00

The transformer can be tested with a multimeter. As shown in the figure, the first is to detect the on-off of the winding coil, the second is to detect the insulation resistance between the winding coils, and the third is to detect the insulation resistance between the winding coil and the iron core. View >>

Date：2021-04-26 16:29:00

Failure analysis is an important part of chip testing. Whether for mass-produced samples, design links or customer returned products, failure analysis can help reduce costs and shorten the cycle. Common failure analysis methods include decap, X-ray, IV, Emmi, FIB, SEM, EDX, probe, OM, RIE, etc. because failure analysis equipment is expensive, most demand units can not match or complete the required equipment. Therefore, it is also a good choice to use external forces and open resources to complete their own analysis. What information do we need to prepare when we choose to test outside? Let's sort it out for you: View >>

Date：2021-04-26 16:19:00

The ability or possibility of the product to perform the specified function without failure under certain time or conditions. The reliability of products can be evaluated by reliability, failure rate and mean time between failures. Moreover, this is an important quality index. Only qualitative description is not enough. It must be quantified in order to make accurate description and comparison. View >>