Date：2021-09-16 16:15:23

PCBA lead-free solder joint reliability test mainly refers to the thermal load test (temperature impact or temperature cycle test) for electronic assembly products; Carry out mechanical stress test on the junction of electronic devices according to the fatigue life test conditions; Use the model for life assessment. As the carrier of various components and the hub of circuit signal transmission, PCBA has become the most important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment. In order to verify the reliability of PCBA lead-free solder joints in the actual working environment, it is necessary to test the reliability of PCBA lead-free solder joints. View >>

Date：2021-09-16 16:08:00

How can X-ray detection technology be better applied to PCBA? First, let's understand the development of PCBA industry. With the development of high-density packaging technology, testing technology is also facing new challenges. Many new technologies are also emerging to meet new challenges. X-ray detection technology is a very important method. Through X-ray detection, the welding and assembly quality of BGA can be effectively controlled. At present, X-ray detection system is not only used for laboratory analysis, but also used in many production industries. PCBA industry is one of them. X-ray detection technology is a necessary means to ensure the quality of electronic assembly to some extent. View >>

Date：2021-09-16 15:32:07

The purpose of chip testing is to eliminate failure and potential failure chips in the process of design and production and prevent defective products from flowing into customers. Therefore, we need to increase the evaluation of chip test level when selecting the type. Through the communication with the original factory and the sealing and testing factory, we can obtain the key parameters and indicators in the stage of chip design verification → process inspection → wafer test → chip finished product test for comprehensive evaluation. View >>

Date：2021-09-16 15:22:30

Nowadays, in electronic assembly technology, people's awareness of environmental protection is becoming stronger and stronger. From the aspects of environmental protection, legislation, market competition and product reliability, lead-free is imperative. However, at present, lead-free is not mature in theory and application, and a relatively unified standard has not been formed. View >>

Date：2021-09-15 18:24:24

In the electronic manufacturing industry, the words RoHS and lead-free are the most seen. Many chips use lead-free materials, such as pins and tin balls, and slowly change from lead to lead-free. Reliability has become the focus of many people's attention. Unlike other lead-free related issues (such as alloy selection, process window, etc.), we often hear very different views on reliability. At the beginning, I heard many people say that lead-free is more reliable than tin lead, and some people say that tin lead is more reliable than lead-free. How should we judge at this time? In fact, it depends on the specific situation. View >>

Date：2021-09-15 18:19:43

In fact, the so-called burning is to write code or data inside, which requires specific software and specific hardware, and the data format is generally specific. Chip burning is an important part of the production of electronic products. When burning, you may encounter the problem that the burning speed of some chips is too slow, affecting the production efficiency, which is also an important aspect of customer concern. The burning efficiency is inseparable from the burning speed of the chip. What factors are related to the burning speed of the chip? Let's have a look! View >>

Date：2021-09-15 15:41:01

Nondestructive testing is a new comprehensive application technology in the third testing industry. On the premise of not damaging the service performance of the tested object, it applies a variety of physical principles and chemical phenomena to effectively inspect and test all kinds of engineering materials, parts and structural parts. One of the main purposes of NDT is to provide real-time process quality control for raw materials, semi-finished products, finished products and product components of discontinuous processing (such as multi process production) or continuous processing (such as automatic production line), especially to control the metallurgical quality of product materials and production process quality, such as defect condition, organization state At the same time, the quality information obtained through the inspection can be fed back to the design and process department to further improve the design and manufacturing process to improve the product quality View >>

Date：2021-09-15 15:38:00

The failure of a solder joint may cause the failure of the whole device, so how to ensure the quality of solder joint is an important problem. Traditional lead tin solder contains lead, and lead and lead compounds are highly toxic substances. The long-term use of lead solder will bring serious harm to human health and living environment. At present, the demand for lead-free soldering in the electronic industry is becoming more and more urgent, which has had a great impact on the whole industry. Lead free solder has begun to gradually replace lead solder, but lead-free technology will inevitably bring new problems to the reliability of solder joints due to the difference of solder and the adjustment of welding process parameters. Next, what reasons may affect the reliability of lead-free solder joints? View >>

Date：2021-09-14 17:39:03

Industrial CT, industrial computed tomography, It is known as the "best nondestructive testing method". Using industrial CT, the internal structure of the object can be detected non-contact and non-destructive, and the data and images without overlap can be obtained. It can not only accurately give the three-dimensional position data of the internal details of the object, but also quantitatively give the detailed radiation density data. It can quickly, accurately and intuitively find the internal defects of the product (defect type, location, size, etc.), such as cracks, pores, porosity, inclusions and other defects, and analyze them to find the root cause of defects, so as to improve product performance and prolong product service life. For this reason, industrial CT has become a versatile and comprehensive expert. Defect detection, welding quality diagnosis, internal structure and assembly state in precision workpiece, such as pores and cracks View >>

Date：2021-09-14 17:33:30

With the progress of society and the development of science and technology, automatic detection methods begin to replace the traditional manual methods to improve enterprise production efficiency and product quality. Based on automatic detection, it not only solves the false detection and missing detection caused by the low efficiency and slow speed of manual methods, as well as the subjective constraints of inspectors, but also many systems have realized nearly 100% defect detection. At present, automatic defect detection based on machine vision is widely used. The quality of optical elements mainly depends on the surface quality, and the detection of surface shape deviation, surface roughness and surface defects are the main items to evaluate the surface quality of optical elements. Today we will introduce machine vision detection technology. View >>