Date：2021-09-18 17:45:44

With the continuous innovation of chip technology and chip packaging technology, the chip area and packaging area are developing towards smaller, lighter and thinner, the number of pins is increasing, the pin spacing is decreasing, and the difficulty of chip appearance detection is also increasing. The traditional manual detection method has been difficult to meet the high requirements of detection and can not adapt to mass production. Machine vision detection system is widely used in various fields, from medical images to remote sensing images, from industrial production detection to file processing, from nano technology to multimedia database, almost all occasions that need human vision need machine vision detection system, especially in some fields that require high or cannot be perceived by human vision, such as accurate quantitative perception The role of machine vision detection system is particularly important for the perception of dangerous scene and invisible objects View >>

Date：2021-09-18 17:42:00

With the continuous development of electronic technology, SMT technology is becoming more and more popular, the volume of single chip microcomputer chip is becoming smaller and smaller, and the foot position of single chip microcomputer chip is also gradually increasing, especially BGA single chip microcomputer chip appeared in recent years. Because the BGA single chip microcomputer chip is not distributed according to the traditional design, but distributed at the bottom of the single chip microcomputer chip. According to the traditional artificial vision detection, it is undoubtedly impossible to judge the quality of the solder joint, so it must be tested according to ICT and even function. However, if there are batch errors, they cannot be found and corrected in time. Artificial vision detection is the most inaccurate and reproducible technology. Therefore, X-ray detection technology is widely used in SMT post reflow detection. It can not only qualitatively analyze the solder joint, but also find and correct the fault in time. View >>

Date：2021-09-18 15:30:42

The failure form of metal materials is closely related to the failure cause. The failure form is the apparent characteristic of the material failure process, which can be observed in a proper way. The failure reason is the physical and chemical mechanism leading to component failure, which needs to be diagnosed and demonstrated through the investigation and research of failure process and the macro and micro analysis of failed parts. This paper collects and arranges some relevant data of metal material testing, hoping that this paper can be of great reference value to all readers. View >>

Date：2021-09-18 15:03:05

Weldability refers to the ability of materials to be welded into components specified by design requirements and meet predetermined service requirements under specified welding conditions. For the metal with good weldability, the welded joint is not easy to produce cracks, pores and slag inclusion defects, and has high mechanical properties. The weldability of metal materials refers to the difficulty of obtaining high-quality welded joints under certain welding methods, welding materials, process parameters and structural types. The main factor of weldability of steel is chemical composition. Among various elements, the influence of carbon is the most obvious, and the influence of other elements can be converted into the influence of carbon. Therefore, the weldability of welded steel can be estimated by carbon equivalent method. Sulfur and phosphorus also have a great impact on the welding performance of steel. In all kinds of qualified steel, sulfur and phosphorus should be strictly limited. View >>

Date：2021-09-18 14:54:59

In recent years, as metal materials are more and more widely used in various fields of production and life, the problem of material failure is becoming more and more prominent. Material failure mainly refers to the mechanical component can not fully complete the predetermined function due to the change of size, shape or material organization and performance. The failure modes of metal materials in various engineering applications are mainly composed of fracture, corrosion, wear and deformation. The scope of metal material testing and analysis involves mechanical performance testing, chemical composition analysis, metallographic analysis, precision dimension measurement, nondestructive testing, corrosion resistance test and environmental simulation test of ferrous metals, non-ferrous metals, mechanical equipment and parts. View >>

Date：2021-09-18 14:50:59

(1) According to the macroscopic deformation before material fracture, the fracture is divided into ductile fracture and brittle fracture. (2) Ductile fracture is an obvious macroscopic plastic deformation before fracture. Brittle fracture is that plastic deformation does not occur before fracture, and its fracture is flush after fracture, which is composed of countless shiny small planes. View >>

Date：2021-09-17 18:12:29

PCBA test is an important part of controlling product quality in PCBA process. In order to ensure the quality of PCBA, it is necessary to carry out corresponding PCBA reliability test, so PCBA reliability test is particularly important. There are many contents of reliability test. Next, I'll give you a brief introduction. View >>

Date：2021-09-17 17:47:20

With the progress of science and technology, intelligent products are increasing day by day. From computers and smart phones to automotive electronics and artificial intelligence, we can see them everywhere in our production and life. The key to their development is the semiconductor chip that drives the internal transceiver. Due to the continuous improvement of product quality and reliability requirements, failure analysis is becoming more and more important. Chip failure analysis can help IC designers find design defects, mismatch of process parameters or improper design and operation. Next, let's look at the chip IC failure analysis test. View >>

Date：2021-09-17 17:45:00

In order to ensure the application quality and safety factor of wiring terminals and prevent the occurrence of redundant common faults, it is proposed to scientifically study and formulate relative selection technical standards according to the technical standards of commodities and carry out purposeful reliability detection to prevent invalid. The terminal line inspection generally involves the following items: plugging force test, durability test, insulation resistance test, vibration test, mechanical impact test, cold and hot impact test, mixed gas corrosion test, etc. View >>

Date：2021-09-16 16:38:00

The connotation of electronic products is very extensive, including not only electronic materials and electronic components, but also installing them in the designated position according to the established assembly process procedures, design assembly drawings and wiring diagrams, according to certain accuracy standards, technical requirements and assembly sequence, and then connecting all parts of the circuit with each other by conducting wires to form a whole with independent performance. SMT packaging technology widely used in electronic packaging, new chip size packaging (CSP), solder ball array (BGA) and other packaging technologies require direct electrical and rigid mechanical connection between different materials through solder joints (mainly bearing shear strain). Production practice has proved that good electrical contact is an important factor to ensure the quality and reliability of electronic products, The failure of electronic products is closely related to the quality of electrical installation. Main text View >>