Date：2021-09-23 15:24:41

The purpose of failure analysis of electronic components is to confirm the failure phenomenon of electronic components with the help of various test and analysis technologies and analysis procedures, distinguish their failure mode and failure mechanism, determine the cause of their final failure, put forward suggestions for improving design and manufacturing process, prevent the recurrence of failure and improve the reliability of components. Failure analysis is an important part of product reliability engineering. Failure analysis is widely used to determine the causes of production problems in the development and production process, identify reliability related failures in the test process, and confirm the field failure mechanism in the use process. View >>

Date：2021-09-23 15:22:40

Failure analysis is an important part of product reliability engineering. Failure analysis is widely used to determine the causes of production problems in the process of development and production, identify reliability related failures in the process of testing, and confirm the on-site failure mechanism in the process of use. In the development stage of electronic components, failure analysis can correct errors in design and development and shorten the development cycle; In the production, testing and use stage of electronic components, failure analysis can find out the failure causes of electronic components and the responsible party causing the failure of electronic components. What are the main failure analysis methods? Let's have a look. View >>

Date：2021-09-23 11:46:00

Solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB, pad, solder and flux by the principle of wetting balance method. Whether it is an obvious poor welding problem, or a problem that is not easy to detect or will affect the tin loading ability of the product, it can be found through the test and find out the root cause, so as to help the enterprise effectively determine the weldability and product quality after production and assembly. View >>

Date：2021-09-23 11:42:19

Surface assembled components, also known as sheet element devices, are divided into surface assembled components and surface assembled devices, which are recorded as SMC or SMD. They are micro electronic components without leads or with short leads, which are suitable for surface installation. With the rapid development of surface assembly technology and chip components, the type and quantity of chip components have increased significantly and become the mainstream products of electronic components. The main inspection items of SMT SMT surface assembly components incoming inspection include weldability, solder resistance, pin coplanarity and usability. There are two methods for weldability: wetting test and immersion test. View >>

Date：2021-09-22 16:30:16

In electronic manufacturing, the connection of components needs to be welded. The quality of welding has a great impact on the quality of manufacturing. The welding of electronic components is divided into three categories: fusion welding, pressure welding and brazing. Now commonly used tin welding belongs to soft soldering in brazing (the melting point of solder is lower than 450 ℃), which is called tin welding because lead tin solder is used for welding. Fusion welding and pressure welding are generally used for high-power electronic components and equipment with special requirements. Welding is a very important link in the maintenance of electronic products. After the fault of electronic products is detected, welding is followed. View >>

Date：2021-09-22 16:24:00

The process flow of PCBA patch processing is very complex, including PCB manufacturing process, component procurement and inspection, SMT patch assembly, dip plug-in, PCBA testing and other important processes. PCBA function test refers to a test method that provides a simulated running environment (excitation and load) for the test target board to make it work in various design states, so as to obtain the parameters of each state to verify the function of PCBA. Simply put, it is to load appropriate excitation on PCBA and measure whether the output response meets the requirements. It generally refers to PCBA function test after PCBA is powered on. View >>

Date：2021-09-22 15:14:08

There are many methods of electronic testing. Among them, solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB, pad, solder and flux through the principle of wetting balance method. It is of great help to the level 1 (IC packaging) and level 2 (electronic components assembled to printed circuit board) processes of modern electronic industry, which need high-quality interconnection technology and high-quality and zero defect welding process. Solderability of components refers to their ability to be welded within a specified time and at a specified temperature. It is related to the thermal characteristics, wettability and heat resistance of components. For example, optical fiber socket is difficult to weld by hand because of its large heat capacity. Let's take a look at the solderability test methods and tools of electronic components View >>

Date：2021-09-22 15:10:45

In the international standard classification, the solderability test center involves non-ferrous metals, metal material tests, printed circuits and printed circuit boards, environmental tests, electrical and electronic tests, welding, brazing and low-temperature welding, integration of electronic components, electronic component components, fasteners for aerospace manufacturing, and electrical equipment and systems for aerospace. In the Chinese standard classification, the solderability test center involves precious metals and their alloys, metal process performance test methods, printed circuits, welding and cutting, environmental conditions and general test methods, reliability and maintainability, basic standards and general methods, and connectors. View >>

Date：2021-09-22 11:40:00

As we all know, the production of electronic products needs to take into account both software and hardware. In short, the integration of operating system and hardware is a knowledge. After consumers obtain an electronic product, the appearance and use experience can get feedback at the first time. Even if the separate hardware or operating system can confuse the real with the false, there is still a considerable threshold for the integration of the two. If the integration is not good enough, it will directly affect the use experience of consumers. At present, there is a lack of core market, a large area of supply chain is in an unbalanced state, and a variety of components are in shortage. China has almost the world's largest electronic component Trading Distribution Center, where there are large and small businesses that disassemble tens of thousands of e-waste every day. All these provide market opportunities for fake chips. Most of them are circulated at home, and some are also circulated to overseas supply chains. View >>

Date：2021-09-18 17:55:29

The failure analysis of metal materials focuses on the phenomenon that the mechanical or mechanical parts and components can not better complete the specified function or the mechanical components lose the original design function due to the change of size, shape, material performance or structure during the use of structural parts (or in the test process before use). So as to find out the main causes of structural member failure, as well as failure prevention measures and product improvement scheme tips. View >>