Date：2021-09-26 11:51:00

As the source power of the rapid development of modern electronic information technology industry, chip has been widely penetrated and integrated into every field of national economic and social development. It is an important support for the digital economy, information consumption and even the long-term development of the country. BGA is an indispensable part of electronic components, but voids often occur in BGA packaging and welding. The generation of voids is mainly due to the bubbles generated by the organic matter in the flux after high-temperature cracking, resulting in the gas being surrounded in the alloy powder to form voids. The generation of voids will affect the use effect of the product to a certain extent, For example, the welding cavity is easy to cause poor contact to electronic components in the later use process and affect the service life. Today, we will introduce several common detection methods for BGA Solder joint defects or failures to help you deeply understand and do View >>

Date：2021-09-26 11:41:00

Program burning is to load the original program into the computer after compilation and processing, and let the computer execute the program you write. For example, when the MCU program is burned, it is loaded Hex file, stored in the single chip microcomputer, can realize the written program when starting up. In short, the process of enabling the microcomputer to start up and execute your program is program burning. Program burning is to carve the desired data into media such as optical disc, burn card (GBA) through recorder and other tools. There are DVD-R / DVD-RW, DVD + R / DVD + RW and other disc recorders in different formats on the market, which can be used to record and permanently save data, which can greatly facilitate the storage of data. The maximum speed supported for disc recording is 20x. View >>

Date：2021-09-24 17:11:01

In the field of consumer electronics, the quality standards of the components used are becoming more and more strict. With the wide use of semiconductor devices, their service life is degraded and eventually lead to failure. A large part of electronic components work in extreme temperature and harsh environment, resulting in failure to work normally, and a large part of components stop in laboratories and wafer factories during R & D. In addition to improper use, surge and electrostatic breakdown, which are all the reasons for the shortening of the service life of semiconductor devices, some devices running normally are also damaged and the components are degraded. View >>

Date：2021-09-24 16:57:00

Chip unsealing, also known as component cover opening and cap opening, is a commonly used destructive detection method in failure analysis. Make local corrosion for the fully packaged IC, so that the IC can be exposed, keep the chip function intact, and keep die, bond pads, bond wires and even lead - from damage, so as to prepare for the next chip failure analysis experiment, facilitate observation or other tests (such as FIB and Emmi), and the function is normal after decap. So what is Kaifeng? What's the use of Kaifeng for us? How did the third-party laboratory open? Now let's take you to learn more. View >>

Date：2021-09-24 15:47:00

When analyzing the internal chips, wires and components in the chip failure analysis, due to the blocking observation of the packaging colloid, the combination of "laser etching" and "wet etching" is used to open the cover (decap) and remove the glue (compound removal), so as to expose the coated objects in the package for subsequent experimental treatment and observation. Opening the chip is equivalent to performing surgery on the chip. Through opening, we can intuitively observe the internal structure of the chip. After opening, we can judge the current situation and possible causes of the sample in combination with OM analysis. This paper collects and arranges some data related to chip cap opening detection, and hopes that this paper can be of great reference value to all readers. View >>

Date：2021-09-24 14:33:00

IC opening, also known as opening, sealing, capping, decap, decapsulation, IC unsealing adhesive, refers to removing the epoxy resin or other packaging materials on the IC die (die, wafer), exposing the die, and preparing for IC decryption, FIB, photographing or preventing decryption. Normal opening does not damage the function of the master chip. Unsealing and capping is a physical-chemical test, which dissolves the epoxy resin colloid on the outer surface of the chip and retains the complete grain or gold wire, so as to check the important marks, layout, process defects, etc. on the grain surface. View >>

Date：2021-09-24 14:25:00

With the continuous upgrading of artificial intelligence technology, product appearance defect detection can also be realized through artificial intelligence technology. Due to the disadvantages of slow detection efficiency and low detection accuracy in traditional artificial detection, visual detection of surface appearance defects can better replace traditional detection methods. At each node, the feature size of the chip becomes smaller and smaller, and the defects are more difficult to find. Defects are undesirable deviations in the chip, which will affect the yield and performance. The advantages of non-contact, continuity, economy and flexibility of machine vision detection make people have a better choice. Manual detection is gradually replaced by machine vision detection. The application of machine vision detection system to semiconductor detection is mainly through positioning the real-time captured image by pattern matching, analyzing and processing the image and obtaining View >>

Date：2021-09-24 12:00:56

Failure mechanism is a physical or chemical process that leads to the failure of parts, components and materials. The inducing factors of this process are internal and external. When studying the failure mechanism, we usually start with the external inducing factors and failure manifestations, and then study the more hidden internal factors. This is also the reverse thinking and exploration for people to understand the essence and development law of things, the basic link and key to change failure into safety, and the source and way for people to deepen their understanding of objective things. In order to help you have an in-depth understanding, this paper will summarize the component failure analysis and detection methods. If you are interested in what this article will cover, read on. View >>

Date：2021-09-23 16:00:34

Failure analysis is a technology to analyze and study the characteristics and laws of failure phenomena such as fracture, surface damage and deformation of components. It has strong practical significance in improving the quality of components, technical development and improvement, product repair and arbitration of failure accidents. It is an activity to simulate and reproduce the failure phenomenon, find out the causes of component failure and dig out the failure mechanism according to the failure mode and phenomenon through analysis and verification. Methods are divided into destructive analysis, nondestructive analysis, physical analysis, chemical analysis, etc. View >>

Date：2021-09-23 15:54:37

Failure refers to the failure of electronic components. The important components of various electronic systems or electronic circuits are generally different types of components. When it needs more components, it indicates that the complexity of its equipment is higher; On the contrary, it is low. Generally, circuit failure is defined as the loss of specified functions of the circuit system. Failure analysis is the process of obtaining the failure mechanism and cause of electronic products through a series of analysis technical means such as electricity, physics and chemistry. Based on the obtained failure mechanism and causes, targeted improvement measures can be taken to improve the reliability and yield of products, shorten the R & D cycle, build a good brand, solve technical disputes and save costs. View >>