Date：2024-04-08 14:45:54

With the widespread application of optocouplers (referred to as optocouplers) in various electronic devices, ensuring their ability to function properly is crucial. Optocouplers, as an important electrical isolation component, achieve the isolation and conversion of electrical signals through the transmission of light. Correctly detecting the quality of optocoupler components can help engineers promptly troubleshoot faults and avoid potential system issues. Below, we will provide a detailed introduction to several specific methods for detecting the quality of optocouplers. View >>

Date：2024-04-07 15:17:41

Reflow soldering is a common surface mount technology widely used in the electronic manufacturing industry. In the reflow soldering process, there are often some problems, such as poor solder joints, component damage, etc., which may affect product quality and production efficiency. This article will introduce common problems in reflow soldering technology, their causes, and solutions to help readers better understand and respond to these problems. View >>

Date：2024-04-07 15:17:38

In the electronic manufacturing industry, the detection of electronic components is a very important part, because the quality and reliability of electronic components directly affect the performance and stability of the entire electronic product. Although traditional visual inspection and mechanical inspection can detect some surface defects, they cannot detect internal defects and structural problems in electronic components. At this point, X-ray testing has become a very effective detection method. View >>

Date：2024-04-03 11:44:54

Reflow soldering technology is a key link in the field of modern electronic manufacturing. Its basic principle is to melt the solder paste and form a solid connection with the solder pads and component pins by heating the pre coated solder pads on the circuit board and the installed electronic components, thereby completing welding. This article will provide a detailed analysis of the basic principles of various reflow soldering techniques and provide an introduction to their use. View >>

Date：2024-04-03 11:44:44

X-ray testing of electronic components is a non-destructive testing method that can detect internal defects and structural issues in electronic components. With the continuous improvement of electronic manufacturing technology, the packaging structure of electronic components is becoming smaller and the internal structure is becoming more complex. Traditional detection methods can no longer meet the requirements. Therefore, X-ray testing has become an indispensable part of the electronic manufacturing industry. View >>

Date：2024-04-02 16:47:00

A small component, from transportation, storage, to production line processes, ultimately being successfully installed on the machine is not as simple as imagined. There are important points to pay attention to in every aspect. If the failure of components causes the PCBA to malfunction, the troubleshooting work will be very cumbersome. Moreover, for general terminal manufacturers, even if a specific component issue is identified, due to limitations, it is not possible to thoroughly investigate its root cause. View >>

Date：2024-04-02 14:58:49

With the rapid development of semiconductor technology, ensuring the quality and reliability of chip products has become one of the key elements of industry development. Semiconductor internal visual inspection technology, as an important means of verifying chip quality, covers various advanced detection methods to discover and analyze subtle defects, abnormal connections, and other issues that may cause product failure in the internal structure of chips. The following are the main aspects of semiconductor internal visual inspection technology: View >>

Date：2024-04-02 14:58:38

Printed Circuit Board (PCB) is an indispensable component of electronic devices, and the quality of PCB has a significant impact on the performance and reliability of the entire electronic product. Due to the complexity and multi-layer structure of PCBs, conventional detection methods are difficult to detect their internal defects. Therefore, a non-destructive and high-precision detection method is needed, and X-ray detection equipment comes in handy. View >>

Date：2024-04-01 14:17:23

X-ray testing is commonly used to detect welding quality, including the quality of BGA (Ball Grid Array) welding. X-ray inspection can detect some welding defects, such as virtual welding, cold welding of solder joints, and misalignment of solder joints. Virtual welding refers to the situation where there is a gap or incomplete welding between the solder joint and the solder pad. X-ray testing can help detect such problems. Specifically, X-ray testing involves penetrating the welded joint with X-rays and capturing the X-ray image on the detector. If there are virtual welds or gaps, X-ray images usually show obvious defects, which can help quality inspectors determine whether the welding is qualified. View >>

Date：2024-04-01 14:17:01

The BGA (Ball Grid Array) chip is a commonly used electronic component, which has the characteristics of high density, high reliability, and high performance, and is therefore widely used in electronic products. Due to the difficulty in observing the internal structure and connection of BGA solder joints, non-destructive testing techniques are needed to evaluate their quality and reliability. View >>