Date：2021-11-12 11:26:00

At present, the demand for lead-free soldering in the electronic industry is becoming more and more urgent, which has had a great impact on the whole industry. Lead free solder has begun to gradually replace lead solder, but lead-free technology will inevitably bring new problems to the reliability of solder joints due to the difference of solder and the adjustment of welding process parameters. The failure of a solder joint may cause the failure of the whole device, so how to ensure the quality of solder joint is an important problem. Traditional lead tin solder contains lead, and lead and lead compounds are highly toxic substances. The long-term use of lead solder will bring serious harm to human health and living environment. View >>

Date：2021-11-12 11:15:46

Tape braiding is a process in small capacitors. Before gold spraying, tape the core into a disc with adhesive tape paper, and protect the side of the core, so that the gold spraying will not spray on the side of the core and will not cause short circuit. There is also a finished tape braiding process for small plastic shell capacitors and small plastic encapsulated capacitors, that is, the capacitors are braided one by one onto a paper tape and wound up for packaging and preservation. The equipment used is braiding machine, which is also called braiding packaging machine and winding packaging machine. It is mainly used for packaging SMD materials, led, inductance, resistance and other reel packaging. Braided packaging is a new type of packaging. View >>

Date：2021-11-11 13:40:00

Chip decap, also known as chip unsealing or chip cap opening, is a common detection method for chip failure analysis. Usually, the data book can provide a lot of information about the chip. If you want to design reliable, low-power and high-performance chip products, you can't stay in the data book. You need to deeply study the internal working principle of the integrated circuit, the relationship between its manufacturing process and its performance, and have a certain ability to analyze the integrated circuit. View >>

Date：2021-11-11 11:39:44

Integrated circuits are divided into commercial devices, industrial devices, automotive industrial devices and military devices. The operating temperature range is also different. Commercial grade devices are 0 ~ + 70 ℃, industrial grade devices are - 40 ~ + 85 ℃, automotive industrial grade devices are - 40 ~ + 125 ℃, and military grade devices are - 55 ~ + 155 ℃. Whether the device can be baked can be judged according to the temperature level and baking temperature of the device. View >>

Date：2021-11-10 15:31:41

There are many links involved in PCBA processing and manufacturing process. We must control the quality of each link to produce good products. Generally, PCBA consists of a series of processes, such as PCB circuit board production, component procurement and inspection, SMT patch processing, plug-in processing, program firing, PCBA testing, aging, assembly and so on, Let's focus on analyzing the related problems of function test: View >>

Date：2021-11-10 14:56:03

In SMT processing, because many high-precision PCBA circuit boards have a large number of BGA and IC chips, the internal welding status of the core devices of this package can not be seen directly from the surface after welding. Therefore, SMT processing plant must be equipped with relevant testing equipment. The testing equipment for this kind of welding here is mainly X-ray. View >>

Date：2021-11-09 13:54:46

X-ray testing technology is a mature nondestructive testing method. At present, it is widely used in the fields of material testing (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA / REL), R & D (R & D), etc. It can be used to detect the delamination, crack and other defects (crack, delamination, cavity, etc.) of electronic components, LEDs and metal substrates, judge whether there are defects in the material by detecting the image contrast, determine the shape and size of defects, and determine the orientation of defects. View >>

Date：2021-11-09 13:37:00

PCBA is a system composed of PCB and various electronic components. The main material of PCB is the composite of glass fiber and epoxy resin, which is divided into single panel, double-sided board and multilayer board. In the process of PCBA welding, poor PCBA welding will be caused by the influence of welding data, process, personnel and other factors. Next, we mainly introduce the analysis of poor PCBA performance in welding. View >>

Date：2021-11-08 18:25:01

In the macro sense, CPU is the product crystal with the highest scientific and technological content, the most complex process and the most fine structure. From the micro perspective of everyone, CPU seems to be just a commodity, or the kind that everyone can afford. CPU is mainly composed of a lot of arithmetic units, controllers and registers. What does CPU cover opening mean? CPU cover opening is nothing more than opening the metal cover on the top of the CPU through the CPU cover opener, mainly to replace the silicone grease on the wafer with liquid gold and further improve the heat dissipation performance of the CPU. View >>

Date：2021-11-05 15:00:00

Rapid temperature change test is a kind of environmental test. The rapid temperature change test chamber is used to set a certain temperature change rate for the rapid transition between high temperature and low temperature. It is used to determine the adaptability of products to storage, transportation and use in the climate environment with rapid changes of high temperature and low temperature. The severity of the rapid temperature change test depends on the high / low temperature range, the change time, and the number of cycles. The test process generally takes normal temperature → low temperature → low temperature residence → high temperature → high temperature residence → normal temperature as a test cycle. Verify the change of functional characteristics of the sample after temperature change or continuous temperature change environment, or the operation functionality in this environment. View >>