Date：2024-04-15 11:56:44

Destructive Physical Analysis (DPA) of electronic devices is a technique that can help manufacturers determine the safety performance of components under potential attacks. It is a very important part of the electronics industry, helping to achieve high-quality and safe product production. After the secondary screening of components is qualified, destructive physical analysis (DPA Destructive Physical Analysis) tests should be conducted on components with unstable quality and significant improvement in production processes in the early stage. The focus is on conducting this work on semiconductor discrete devices and semiconductor integrated circuits with cavities. Its purpose is to verify whether the quality of the components meets the relevant specifications or intended use. View >>

Date：2024-04-12 11:42:52

In the electronic manufacturing industry, reflow soldering is a commonly used surface mount technology that can solder surface mount components (SMDs) to printed circuit boards (PCBs). The process of reflow soldering requires strict control of temperature and time, and adjustments should be made according to the requirements of solder paste and mounting components. When using reflow soldering for welding, attention should be paid to details such as temperature control, solder paste quality, component placement, welding time, cooling speed, and quality inspection. This article will provide a detailed introduction to the precautions that need to be taken during reflow soldering, in order to help readers better grasp reflow soldering technology and improve soldering quality. View >>

Date：2024-04-12 11:42:47

Reflow soldering is a common surface mount technology used to solder surface mount components (SMDs) onto printed circuit boards (PCBs) in electronic product manufacturing. The process of reflow soldering is to place the mounted components on the PCB, and then send the entire assembly into the reflow furnace for heating, melting the solder paste and soldering the mounted components onto the PCB. View >>

Date：2024-04-11 13:50:17

The quality of reflow soldering is influenced by various factors, among which the most important factors are the temperature curve of the reflow soldering furnace and the composition and quantity of solder paste. Nowadays, high-performance reflow soldering furnaces can easily and accurately control and adjust temperature curves. In the trend of high density and miniaturization, the printing of solder paste has become a key factor in the quality of reflow soldering. The three factors of solder paste, template, and printing can all affect the quality of solder paste printing. View >>

Date：2024-04-11 13:50:04

Reflow soldering is a welding process mainly used for connecting surface mount components in electronic manufacturing. If you are interested in the upcoming content, please continue reading the following text, hoping it will be helpful to you. View >>

Date：2024-04-10 14:09:26

Reflow soldering is a process technology used to solder electronic components onto PCB boards, named after its heating method similar to river reflow. This process mainly transfers heat to the solder through thermal conduction, melting the solder and metallurgical bonding it with the component pins and copper foil on the PCB board, achieving reliable connection between the components and the PCB board. Reflow soldering technology has the advantages of high automation, stable and reliable welding quality, and is widely used in the field of electronic manufacturing. This article will provide a detailed introduction to the process flow of reflow soldering. View >>

Date：2024-04-10 14:09:14

In the field of electronic product manufacturing, especially in high reliability industries such as aerospace, military, and automotive, PIND (Particle Impact Noise Detection) is widely used as a non-destructive testing technology to ensure the internal structural integrity of components and components. The accuracy and reliability of PIND detection results largely depend on the environmental conditions in which they are located. This article will explore in detail the specific requirements of PIND testing for environmental conditions, in order to provide operational guidance and reference for relevant practitioners. View >>

Date：2024-04-09 14:51:00

In PCBA processing, two common welding methods are reflow soldering and wave soldering. So what is the role of reflow soldering in PCBA processing, what is the role of wave soldering, and what are their differences? This article will provide a detailed explanation. View >>

Date：2024-04-09 14:50:57

Industrial CT (Computed Tomography) is a non-destructive detection technology that can detect and analyze the internal structure of objects through three-dimensional imaging. Industrial CT technology has many advantages and can be widely applied in manufacturing, materials science, medicine and other fields. View >>

Date：2024-04-08 14:46:09

X-ray detection is a very important detection project, which has a wide range of applications in the electronic component industry. X-ray detection equipment can detect various materials in electronic components. Based on X-ray transmission images, the internal composition, structure, and appearance of electronic components can be viewed to detect internal defects and ensure the quality of electronic components. View >>