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Introduction to PCB reliability test design

Date:2021-12-30 14:04:00

With the development of the times, PCB circuit board plays an important role. The competition of terminal products is becoming increasingly fierce, which is bound to put forward higher requirements for the reliability of PCB products. When designing a reliable circuit board, you need to follow the same PCB design process. When designing a key circuit, its components and quality must be checked first, and a number of reliability tests must be carried out. View >>

What are the factors affecting chip reliability? What are the national standards?

Date:2021-12-29 14:27:16

Chip reliability test is mainly divided into two major items: environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, outgoing line tensile strength test and outgoing line bending test), outgoing line weldability test, temperature test (low temperature, high temperature and temperature alternating test) Damp heat test (constant humidity and alternating damp heat), special test (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be done selectively. View >>

What factors affect the reliability of electronic packaging? Detailed description of defects and failures

Date:2021-12-29 14:06:43

Electronic packaging is the process of converting chips into devices that can work reliably in the electronic manufacturing industry chain. Because bare chips can not withstand the load of the working environment for a long time and lack the necessary electrical signal connection, they can not be directly used in electronic equipment. Therefore, although different types of products are different, the main functions of electronic packaging are relatively similar, mainly including four functions: mechanical support, fixing the chip and other internal components in the specified position; Environmental protection to protect the chip from external loads such as water vapor, corrosion, dust and impact; Interconnection of electrical signals to provide electrical path and power supply for internal components; Heat dissipation to export the heat generated during chip operation in time [1]. According to different process stages, electronic packaging can generally be divided into zero level packaging (chip level interconnection) and first level packaging (chip level packaging) View >>

rohs2. 0 test items and limits required by laws and regulations

Date:2021-12-28 14:43:00

rohs2. What are the 0 test items? At present, the version of RoHS is 2.0, and 6 tests are mandatory for products exported to the EU. Ten mandatory tests will be conducted from July 22, 2019. RoHS2. 0 is an upgraded version of the old ROHS test item. 2011 / 65 / EC Directive is changed to rohs10 items: lead (PB), cadmium (CD), mercury (Hg), hexavalent chromium (Cr6 +), polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs), di-n-butyl phthalate (DBP), n-butyl benzyl phthalate (BBP), 2-hexyl phthalate (DEHP), hexabromocyclododecane (hbcdd). View >>

Test methods and key points of integrated circuit comprehensive performance

Date:2021-12-28 13:50:00

An electronic product, from the initial model prototype to the hands of consumers, an important thing related to whether the electronic product can leave the factory is to see whether the electronic product can pass the test of reliability test equipment. All products must have a certificate before they can be sold to consumers. If electronic products want to get a certificate, they must pass the test of reliability test equipment. The working principle of this reliability test equipment is to simulate the working environment of electronic products and make these electronic products work in different environments, such as high temperature and high humidity, To test the high temperature and humidity resistance of these electronic products. Through the detection of these reliability test equipment, we can know what else this type of electronic products have View >>

How to ensure program quality in IC burning production? What are the treatment methods?

Date:2021-12-28 13:42:00

Not all ICs can be burned, only memory can be burned. But now many single-chip computers have integrated program memory, so single-chip computers can also burn. The principle of the burner is to change the internal 010101 structure of the chip by powering up the chip within the allowable timing range for the programmable chip, so as to achieve the expected effect. It is mainly used for programming (or brush writing) of chips such as single chip microcomputer (including embedded) / memory (including BIOS). As the core component of a product, once its internal program is stolen, the whole product will face the risk of cracking. This paper will introduce the production method of IC burning to ensure quality and safety. View >>

Basic knowledge of reliability testing of electronic products

Date:2021-12-28 13:22:00

Reliability test can be divided into environmental test, life test, special test and field service test. The reliability test of electronic products generally includes: high and low temperature, temperature impact, transportation vibration, drop, high accelerated life test, etc. Among them, high accelerated life testing (halt test for short) is a process of revealing design defects and deficiencies by using the vibration system of rapid high and low temperature transformation for electronic and mechanical assemblies. The purpose of halt is to identify the function and failure limit of the product in the early stage of product development, so as to optimize the reliability of the product. View >>

Failure analysis and detection center: failure forms and causes of electronic parts

Date:2021-12-27 14:10:00

The main failure modes of electronic components include but are not limited to open circuit, short circuit, burning, explosion, electric leakage, function failure, electrical parameter drift, unstable failure, etc. Failure may occur in all stages of the product life cycle, in all links from product development stage, production stage to use stage. By analyzing the failed products of process waste and defective products, early failure, test failure, pilot test failure and on-site failure, the failure mode and failure mechanism are clarified, and finally the failure cause is clarified. View >>

Test items and evaluation criteria for electrical performance of IC chips

Date:2021-12-27 14:03:37

The electrical performance of electronic and electrical equipment directly affects the safe and reliable operation of the whole electrical system. In order to ensure the safety of equipment, all electronic and electrical equipment must pass various type tests in the production and manufacturing process to ensure the safety of electrical environment. The electrical performance test includes the basic parameter test of conductor or insulation quality, such as conductor resistance, insulation resistance, correct value of dielectric loss angle, capacitance, etc. The higher the working voltage of the cable, the stricter the requirements for its electrical performance. View >>

Can't the chip burning program burn in? Cause analysis of bad burning

Date:2021-12-27 13:57:58

Some engineers probably have no problem burning chips in the R & D and testing stage, but once they enter mass production, the production department will frequently feed back the poor burning of chips. What is the reason? Can't the chip burning program burn in? The following mainly introduces the cause analysis of poor burning. View >>

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