Date：2022-01-07 13:32:00

The spring tide of core shortage continued, and several original factory price increases took effect around New Year's day, some of which were announced in the fourth quarter of last year, and some just announced. The price increase of these original factories just corresponds to the price increase of a new round of wafer foundry. This time, liandian "plays the most". In addition, the recent storage market is also variable due to the epidemic, but the impact is relatively limited compared with wafer foundry. View >>

Date：2022-01-07 13:30:00

Chip quality is mainly determined by three factors: market, performance and reliability. Firstly, in the early stage of chip development, it is necessary to fully investigate the market in order to define a spec that meets the needs of customers; The second is the performance. The circuit designed by the IC design engineer needs to pass designer simulation, DFT circuit verification, laboratory sample evaluation and FT before sample shipment to consider that the performance meets the requirements of the previous definition; Finally, reliability. Since the tested chip can only ensure that the customer is good when he first gets the sample, a series of stress tests are also required to simulate the impact of some harsh service conditions on the chip by the client, so as to evaluate the life of the chip and the possible quality risk. View >>

Date：2022-01-07 12:00:10

As long as there is no problem in the design of general digital circuits, digital circuits are relatively stable. The most likely problems are those separate components, such as transistors and so on. Therefore, it is best to use more mature circuits and integrated circuit modules in the design, which will ensure the stability of the system. Aiming at the fault phenomenon of electronic products, we can deal with the faulty components through observation, hearing, feeling and touch, eliminating many unnecessary testing methods. If the above methods do not work, instruments and meters need to be used to test the suspicious components and related circuits to find out the fault point. When some components fail, the whole or some parts of the circuit will usually be shut down, making it unable to work, resulting in abnormal changes to electronic products. Therefore, the judgment and maintenance of component failure is a very important step. View >>

Date：2022-01-07 11:56:00

A large number of various types of electronic components are used in electronic equipment. Most of the equipment failures are caused by the failure or damage of electronic components. Failure analysis plays an important role in ensuring and improving the reliability and quality of products. Failure analysis needs to be introduced in product R & D, production and use. The following are some relevant contents of failure detection and sorting of common electronic components for your reference. View >>

Date：2022-01-06 11:52:44

Voice chip is an integrated circuit that can store, control and play voice. It is called speech IC in English. It is an integrated circuit chip with built-in small storage space, 1mbit-4mbit and storage time of 40-160 seconds. It can be controlled by keys or MCU. It is also to convert the voice signal into digital signal through sampling, store it in the ROM of the integrated circuit, and then restore the digital voice signal in the ROM through the circuit. From the meaning of the name, it can be seen that it is a function of adding voice on the basis of electronic products, that is, the input voice is processed through the chip and played out through the speaker. View >>

Date：2022-01-06 11:41:00

There are many methods of chip burning. In large-scale production, it is still based on burner burning. If you use a burner to burn, you have to use the burning base. The usage times of each burning base can not be effectively monitored. Once the service life of the burning base is exceeded, there is no way to ensure the burning quality of the chip. The burning base does not have the function of detecting whether the burning base matches the chip to be burned, so how to detect whether the chip can be burned? View >>

Date：2022-01-06 11:38:00

With the development of electronic technology, the demand for chips is increasing. In order to improve the production efficiency, multi station IC chip burning technology has been widely used. As a kind of processor, burning chip needs a program to miniaturize all components into one or several integrated circuits; An integrated circuit that can receive coding instructions at one or more ends, execute the instructions and output signals describing its state, and the process of storing programs in the chip is called chip burning. View >>

Date：2022-01-05 15:46:13

Nowadays, due to the damage of an integrated circuit, some or several parts of electronic products can not work often, which affects the normal use of equipment. So how to detect the quality of integrated circuits? The detection methods of integrated circuits mainly include visual method, sensory method, voltage detection method, resistance detection method, current detection method, signal injection method, substitution method, heating and cooling method, step-up or step-down method and comprehensive method. View >>

Date：2022-01-05 15:16:29

In recent years, with the rise of all kinds of intelligent terminal equipment, the quality requirements of electronic products are higher and higher. However, with the continuous influx of various fake and shoddy products into the market, it has an adverse impact on consumers and market reputation. Although the regulatory authorities and market electronic products continue to strengthen supervision, it is still impossible to avoid counterfeit goods. As the core component of electronic products, in order to ensure the quality of chips, manufacturers have adopted effective X-ray nondestructive testing technology for chip testing. View >>

Date：2022-01-05 14:55:00

Failure analysis is a newly developed discipline, which has strong practical significance in improving product quality, technology development, improvement, product repair and arbitration of failure accidents. Comprehensive and systematic failure analysis can determine the cause of failure, guide the improvement of device design, manufacturing process, test or application, and take corresponding corrective measures to eliminate the cause of failure mode or mechanism, so as to improve the overall reliability of devices and equipment. View >>