Login | Join Free

Hotline

4008-655-800
行业资讯
What are the analysis methods of semiconductor chip failure analysis?

Date:2022-03-04 13:57:14

Semiconductors are mainly composed of four components: integrated circuits, optoelectronic devices, discrete devices and sensors. Since integrated circuits account for more than 80% of devices, semiconductors and integrated circuits are usually equivalent. From computers and smart phones to automotive electronics and artificial intelligence, we can see them everywhere in our production and life. The key to their development is the semiconductor chip that drives the internal transceiver. With the expansion of application scenarios and market, the demand for semiconductor chips will undoubtedly increase, and there are higher requirements for their quality. View >>

Type and purpose of electronic product reliability test report

Date:2022-03-04 13:41:00

The development of reliability projects can promote and promote the development of product design, manufacturing, use, materials, processes, equipment and management, and raise electronic components and other electronic products to a new level. Through reliability test, the reliability characteristic quantity of electronic products can be determined when they work or store under various environmental conditions, so as to provide useful data for use, production and design; It can also expose the problems existing in the design, raw materials and process flow of the product. Through a series of feedback measures such as failure analysis and quality control, the existing problems of products can be solved gradually and the reliability of products can be improved. View >>

Basic knowledge of patch welding three common welding technologies

Date:2022-03-03 15:23:00

With the progress of the times and science and technology, more and more circuit boards use chip components. SMT chip components are more and more popular because of their small size and easy maintenance. In PCBA processing, SMT chip components are particularly small in size and light in weight. SMT chip components are easier to weld than lead components. There is also a very important advantage of chip components, which is to improve the stability and reliability of the circuit. For PCBA processing, it is to improve the success rate of manufacturing. View >>

Visual inspection scope, working principle and characteristics of nondestructive test

Date:2022-03-03 14:55:00

Nondestructive testing is a modern way of testing and evaluation without damaging the items to be tested. Nondestructive testing is no longer just using X-ray nondestructive testing, including acoustic, electrical, magnetic, electromagnetic wave, neutron, laser and other physical phenomena are almost used in nondestructive testing, such as ultrasonic nondestructive testing, eddy current nondestructive testing, magnetic particle nondestructive testing, radiographic nondestructive testing, penetrant testing, visual testing, infrared testing, microwave testing, leakage testing Acoustic emission detection, magnetic flux leakage detection, magnetic memory detection, thermal neutron photography detection, laser speckle imaging detection, fiber Bragg grating sensing technology detection and so on, and new methods and technologies are constantly developed and applied. View >>

What are the common components on the PCB? Professional chip test

Date:2022-03-03 14:15:00

Electronic components have different packaging types. The shapes of different types of components are the same, but the internal structure and uses are very different. Complex electronic circuits are also composed of these electronic components. For component identification, it can be distinguished by the printing model. For components without characters, it can also analyze the circuit principle or measure the component parameters with a multimeter. So, what are the common components on PCB board? In order to help you have an in-depth understanding, the following contents are sorted out by Chuangxin testing network for your reference. View >>

Test items and standards of IC chip electrical performance test

Date:2022-03-02 17:56:00

The electrical performance of electronic and electrical equipment directly affects the safe and reliable operation of the whole electrical system. In order to ensure the safety of equipment, all electronic and electrical equipment must pass various type tests in the production and manufacturing process to ensure the safety of electrical environment. Electrical performance test includes the test of basic parameters of conductor or insulation quality, such as conductor resistance, insulation resistance, correct value of dielectric loss angle, capacitance, etc. The higher the working voltage of the cable, the stricter the requirements for its electrical performance. View >>

What are the reasons for the damage of electronic chips? Method for measuring chip quality

Date:2022-03-02 17:18:00

Chip is a way to miniaturize circuits in electronics, and is often manufactured on the surface of semiconductor wafers. In addition, chip has also been widely used in the fields of communication and network. So what is the general cause of chip damage? View >>

Electronic test items: 8 methods of circuit fault analysis

Date:2022-03-01 18:08:00

In addition to rich theoretical knowledge and practical operation, the troubleshooting method of electronic circuit fault is also very important. A good method can get twice the result with half the effort. So how should the electronic circuit troubleshoot? Generally, it can be detected by input to input sequence or by the reverse method from output to input. No matter from which direction, electronic circuit fault detection can generally be judged by the following eight methods. View >>

Main specifications and parameters of MOS field effect tube

Date:2022-03-01 16:38:00

MOS transistor, also known as field effect transistor, is a common power device in the circuit. According to the material structure, it is divided into two types: n-channel MOS tube and p-channel MOS tube. The letter of FET represents the material, D is p-type silicon, and the inversion layer is n-channel; C is the n-type silicon p-channel. For example, 3dj6d is a junction type p-channel field effect transistor, and 3do6c is an insulated gate type n-channel field effect transistor. The following describes the MOS FET parameter comparison table and main specifications. View >>

Welding knowledge: reflow technical index and defect analysis and treatment

Date:2022-02-28 15:21:45

Reflow soldering is to realize the mechanical and electrical connection between the solder end or pin of surface assembled components and the PCB pad by remelting the paste solder pre allocated to the PCB pad. Reflow soldering technology is no stranger in the field of electronic manufacturing. The components on various boards and cards used in our computer are welded to the circuit board through this process. There is a heating circuit inside the equipment, which heats the air or nitrogen to a sufficiently high temperature and blows it to the circuit board with the components pasted, so that the solder on both sides of the components melts and bonds with the main board. Next, let's introduce the technical indicators and defect analysis of circuit board reflow soldering. Let's have a look. View >>

Baidu
map