What are the main reasons for the failure analysis of PCBA solder joints?

Date：2022-07-11 17:39:30Views：616

Correctly identifying and mitigating the potential causes of solder joint failure in the design and manufacturing process can prevent costly and difficult problems from occurring at the end of the product life cycle.However, in the actual processing process, we will also encounter the problem of PCBA solder joint failure. It is necessary to analyze and find out the cause to avoid the recurrence of solder joint failure. In order to help you understand in depth, this paper will summarize the relevant knowledge of PCBA solder joint failure analysis. If you are interested in what this article will cover, then read on.

Solder joint reliability is usually a pain point in electronic system design. With the development of miniaturization and precision of electronic products, the density of PCBA processing and assembly used by electronic processing plants is getting higher and higher. Various factors will affect the reliability of solder joints, and any one of them will greatly shorten the service life of solder joints.The main reasons for the failure of PCBA processing solder joints are as follows:

1. Poor component pins: plating, pollution, oxidation, coplanar.

2. Poor PCB pad: coating, pollution, oxidation, warpage.

3. Solder quality defects: composition, substandard impurities, oxidation.

4. Flux quality defects: low weldability, high corrosion, low sir.

5. Defects in process parameter control: design, control and equipment.

6. Defects of other auxiliary materials: adhesives and cleaning agents.

How to increase the stability of PCBA solder joints:

The stability experiment of PCBA solder joint includes stability experiment and analysis. On the one hand, its purpose is to evaluate and identify the stability level of PCBA integrated circuit devices and provide parameters for the stability design of the whole machine.On the other hand, in the process of PCBA processing, it is necessary to improve the stability of solder joints. It is necessary to analyze the failed products, find out the failure mode and analyze the failure cause. The purpose is to modify and improve the design process, structural parameters and welding process, and improve the yield of PCBA processing. The failure mode of PCBA solder joint is the basis of predicting its cycle life and establishing its mathematical model.

The above are the main reasons for the failure analysis of PCBA solder joints. I hope it will help you! Shenzhen Chuangxin Online Testing Technology Co., Ltd. is a well-known professional testing institution for electronic components in China, with 3 standardized laboratories covering an area of more than 1000 square meters. The scope of testing services covers: electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, function testing, factory incoming material inspection, component X-ray testing, taping and other test items.