Semiconductor shortage led to a new high of chip fraud last year

Date：2022-06-29 16:39:39Views：1030

According to media reports, a company tracking counterfeiting and fraud in the chip industry said on Tuesday that the serious shortage of semiconductors led desperate buyers to report record cases of wire transfer fraud last year.

According to erai Inc, an American company, 101 cases of wire transfer fraud were reported in 2021, up from 70 in 2020 and 17 five years ago.

Mark Snider, President of erai, said that companies looking for chips were trying to obtain chips from some distributors (but these chips could not pass formal authorization and review) and pay for goods that had never been delivered.

He said that the report was voluntary and that most wire transfer frauds were run by Chinese chip brokers.

According to industry experts, although there is a GIDEP government counterfeit parts database, it does not allow anonymous reports, which makes erai the main database for companies to report chip problems and fraud.

However, the latest data show that 504 chip counterfeiting incidents were reported to erai in 2021 and 463 in 2020. This is a significant decrease from 963 cases in 2019.

Snider said that China's factories closed due to the epidemic may make it more difficult for counterfeiters to operate, and said that counterfeits are becoming more and more complex and difficult to be found.

Fraud researcher diganta Das said that erai's data showed a good trend. However, the true figure may be much larger, as companies worried about brand damage are often reluctant to report their purchases of counterfeit chips.

Shenzhen Chuangxin Online Testing Technology Co., Ltd. is a well-known professional testing institution for electronic components in China, with 3 standardized laboratories covering an area of more than 1000 square meters. The scope of testing services covers: testing and verification of electronic components, IC authenticity identification, material selection for product design, failure analysis, function testing, factory incoming material inspection, X-ray testing of components and parts, tape braiding and other testing items.