What are the influencing factors of PCBA weldability?

Date：2022-06-22 17:47:27Views：769

Welding refers to the manufacturing process and technology of joining metal or other thermoplastic materials by means of heating, high temperature and high pressure. Welding is a very important process in PCB production. If there is no welding, various devices cannot converge on the board, and the so-called circuit board cannot be formed. This article has collected and sorted out some materials, which are expected to be of great reference value to all readers.

The welding process is a very important process in the PCBA processing process. Once the welding reliability is not strong, it will have a great impact on the final welding quality, and it is easy to cause the occurrence of poor welding phenomena such as false welding, tin beads and bridging. There are many factors that affect the welding reliability in the PCBA processing process, such as solder, Material oxidation factors and welding process control factors are the main factors affecting the reliability of PCBA welding.

Weldability refers to the evaluation of welding difficulty in the process of PCBA welding. The stronger the weldability refers to the easier welding in the process of welding and less welding quality problems. The worse the weldability refers to the more difficult the welding is, the more welding quality problems are likely to occur; Solder refers to welding materials, which are usually divided into lead-free solder and lead solder. The solder used for reflow soldering is solder paste, the solder used for wave soldering is tin strip, and the solder used for manual soldering is mostly tin wire;

The factors that lead to the decrease of solderability in the welding process due to solder are: solder composition, solder pollution and solder use. Take solder paste for example, if the composition ratio of solder paste is incorrect, such as the ratio of tin to lead, the ratio of solder to flux is incorrect, or the solder paste is polluted by oil, moisture and oxidation, or the solder paste is fully warmed up during use Mixing will affect the reliability of welding.

In addition to the solder factor, PCB and electronic components are also one of the reasons that affect the solderability, and the main reason is the oxidation problem caused by moisture or pollution of materials. If the PCB pad or the pins of electronic components are oxidized, tin rejection will occur during welding, which will affect the reliability of welding and cause defects such as false soldering and false soldering. In addition, improper welding process operation will also affect the reliability of welding, For example, the temperature during welding is too high or too low, and the welding time is too short or too long.

The above is the content related to the weldability of PCBA prepared by the creative core testing team. I hope it can help you. Shenzhen Chuangxin Online Testing Technology Co., Ltd. is a well-known professional testing institution for electronic components in China, with 3 standardized laboratories covering an area of more than 1000 square meters. The scope of testing services covers: testing and verification of electronic components, IC authenticity identification, material selection for product design, failure analysis, function testing, factory incoming material inspection, X-ray testing of components and parts, tape braiding and other testing items.