Failure technology analysis and reliability test of electronic components

Date：2022-05-25 14:36:04Views：853

The two major contents of reliability research are failure analysis and reliability test (including destructive experiment). The two affect and restrict each other. The rapid development of electronic component technology and the improvement of reliability have laid the foundation of modern electronic equipment. The fundamental task of component reliability is to improve the reliability of components. Therefore, we must pay attention to and accelerate the development of reliability analysis of components, determine the failure mechanism through analysis, find out the failure causes, feed back to design, manufacturing and use, and jointly study and implement corrective measures to improve the reliability of electronic components.

The purpose of failure analysis of electronic components is to confirm the failure phenomenon of electronic components, distinguish their failure mode and failure mechanism, confirm the failure causes of the results, put forward suggestions to improve the design and manufacturing process, prevent the recurrence of failure and improve the reliability of components with the help of various test and analysis technologies and analysis procedures.

Failure analysis items of electronic components

1. Failure of components

Inductance, resistance, capacitance: crack, crack, parameter change

2. Device / module failure

Diode, triode, LED lamp

3. Integrated circuit failure

Dip package chip, PGA package chip, SOP / SSOP series chip, QFP series chip, BGA package chip

4. PCB & PCBA welding failure

Blistering, delamination, solder mask falling off, blackening, migration, oxidation, corrosion, open circuit, short circuit and caf short-term failure on PCB surface; Board surface discoloration, tin surface discoloration and pad discoloration; The insulation performance between holes decreases; Deep hole cracking; Explosive plate, etc

Poor welding of PCBA (ENIG, nickel plating, gold plating, OSP, tin spray plate); Poor tin on the terminal (PIN), foreign matters on the surface, electromigration, component falling off, etc

5. DPA analysis

Resistor / capacitor / thermistor / diode, etc

Electronic component reliability verification service

1、 Product reliability system solution

1. Customization of reliability test scheme

2. Reliability enterprise standard formulation and guidance

3. Life evaluation and prediction

4. Reliability competitive analysis

5. Product evaluation

6. Device quality improvement

2、 Routine environment and reliability project detection method

1. Environmental reliability of electronic components

High / low temperature test, temperature and humidity test, alternating damp heat test, cold and heat shock test, rapid temperature change test, salt spray test, low pressure test, high pressure cooking (HAST), CAF test, gas corrosion test, dust and waterproof / IP grade, UV / xenon lamp aging / solar radiation, etc.

2. Mechanical reliability of electronic components

Vibration test, impact test, collision test, drop test, three comprehensive test, packaging and transportation test / ISTA grade, fatigue life test and plugging force test.

3. Electrical performance reliability

Withstand voltage, breakdown voltage, insulation resistance, surface resistance, volume resistance, dielectric strength, resistivity, conductivity, temperature rise test, etc.

I believe that by reading the above contents, we have a preliminary understanding of the reliability research of electronic components. At the same time, we also hope that we can make a summary in the learning process, so as to continuously improve our professional level.