X-ray knowledge introduction which method is better for IC chip nondestructive testing?

Date：2022-05-20 17:32:35Views：964

The development of chip manufacturing industry is related to all aspects of people's life, ranging from mobile phones, computers, household appliances, to automobiles, aircraft, military, communication and national defense, which are inseparable from the support of the chip industry. Therefore, the reliability of chips is particularly important. Since most chips need full inspection, chip nondestructive testing is particularly important. According to the control of product quality, X-ray testing equipment is often used for product fault analysis. The characteristics of nondestructive testing are very effective for detecting internal defects of products. So, which method is better for IC chip nondestructive testing?

The successful manufacture of a qualified chip requires the joint efforts of various disciplines, such as materials science, metallurgy, optics, electronic circuit and other disciplines. At the same time, the manufacturing process of the chip is also extremely complex, such as smelting high-purity wafers, photolithography, ion implantation, dry and wet etching, plasma flushing, thermal oxidation, physicochemical deposition, electroplating, wafer testing Then to the final packaging test. The last package inspection is the last barrier for the chip to ensure the quality of chip products. The quality of the inspection chip directly affects the overall performance of the factory quality of the chip.

In the process of Sot, sot, SOP, dip, PGA, QFP, LCC, tab, BGA and other series of packaging, different types of defects often appear in the chip packaging due to the different manufacturing process and materials and the different thermal stress coefficients of different materials; Defects such as false soldering, bubbles, voids, voids, cracks, slag inclusions, delamination and other defects will lead to the loss of chip performance, resulting in poor performance and losses to enterprises. More seriously, it will lead to major faults in the process of use. X-ray nondestructive testing technology images the internal structure of the object through the absorption difference of the object to X-ray materials, and then detects the internal defects. It is widely used in the fields of industrial flaw detection, detection, medical detection, safety detection and so on.

1. It can be used to detect whether there are cracks and foreign matters in some metal materials and their components, electronic components or LED components.

2. Internal detection and analysis of BGA, circuit board, etc.

3. Detect and judge the broken wire, false welding and other defects in BGA welding.

4. It can detect and analyze the internal state of cables, plastic parts, microelectronic systems, adhesives and sealing components.

5. Used to detect bubbles and cracks of ceramic castings.

6. Check whether the IC package is defective, such as peeling, cracking, gap, etc.

7. The application of printing industry is mainly reflected in the defects, bridges and circuit breakers in the process of paperboard production.

8. In SMT, the gap between solder joints is mainly detected.

9. In the integrated circuit, it is mainly to detect the open circuit, short circuit or abnormal connection in various connecting wires.

Because chip products are different from other workpieces and cannot be disassembled for destructive testing, the internal packaging defect detection methods are mainly chip nondestructive testing methods: ultrasonic scanning microscope nondestructive testing, and X-ray testing.

1. The principle of X-ray detection is to use the penetration of X-rays to send a beam of rays to the chip. The rays will pass through the chip and form an image based on the internal deconstruction density difference of chip nondestructive detection on the negative film. The smaller the density, the better the perspective effect. On the contrary, the clearer the perspective is, such as the X-ray film in the hospital, which is harmful to people. The disadvantage is that its resolution is not particularly clear, it is not sensitive to false soldering and area defects, and it causes ghosting for the chip detection honor of complex multi-layer structure, resulting in indistinguishable defects.

2. Ultrasonic C-scan detection: ultrasound has unique advantages in identifying defects, and the detection accuracy can reach micron level. Inspired by bats using ultrasound to identify obstacles in a lightless environment. Ultrasonic scanning microscope makes use of the propagation characteristics of ultrasonic wave in the workpiece, such as the energy loss of sound wave when passing through the material, the reflection when encountering the interface of two media with different acoustic impedance, and then image the recovered wave. Its advantages are non-destructive to people, high detection accuracy, strong defect resolution, intuitive imaging, and layer by layer detection. It can detect various types of defects, such as cavities, bubbles, false soldering, cracks and gaps, and perfectly solves the problems that X-ray detection can not detect defects caused by ghosting. Therefore, ultrasonic scanning microscope has always been an authoritative testing equipment in the field of semiconductor and chip nondestructive testing and packaging.

The above is the related content of chip nondestructive testing compiled by Chuangxin testing group. I hope it will be helpful to you. Shenzhen Chuangxin Online Testing Technology Co., Ltd. is a well-known professional testing organization for electronic components in China. It has three standardized laboratories with an area of more than 1000 square meters. The scope of testing services covers: testing and verification of electronic components, identification of IC authenticity, product design, material selection, failure analysis, function testing, factory incoming material inspection, X-ray testing of components, tape braiding and other testing items.