What does DPA mean? Function and efficacy of DPA test

Date：2022-05-13 14:40:00Views：2041

Destructive physical analysis, abbreviated as DPA. It is to randomly select an appropriate number of samples in the production batch of components, and use a series of non-destructive and destructive methods to test whether the design, structure, material and manufacturing quality of components meet the intended purpose and relevant specification requirements. And whether it meets the reliability and supportability specified by the components, dissect the component samples, and conduct a series of inspection and analysis before and after dissection. It is used to determine whether there may be quality problems of component batches that endanger the use and lead to serious consequences.

Destructive analysis of electronic components (DPA) is used to analyze the functional status of specific electronic components. It was first used in the United States. The key point of destructive physical analysis of electronic components is destructive physical analysis. Dissect the electronic components, analyze their internal elements, compare their specific structure with the design, analyze whether the actual situation of their internal structure meets the design, and whether the material situation matches the design, and then determine whether the function of electronic components meets the design standard. The main purpose of specific destructive analysis of electronic components is to determine whether the functions of electronic components meet the design requirements. Through the comparison between specific test items and design, the quality judgment of electronic components can be completed. The destructive analysis of electronic components can be used in the electronic component industry to analyze the product qualification rate and lay the foundation for its process improvement.

DPA analysis technology can be widely used in the process of component production and after production to before the machine, so as to check whether the components have potential defects in materials, processes and so on. It can be summarized in the following aspects:

1) It is used to analyze the causes of unqualified electrical characteristics of electronic components without complete loss of function;

2) It is used for the production process of electronic components, especially the quality monitoring of key processes and the quality analysis and control of semi-finished products;

3) Used to control failure modes related to product design, structure, assembly and other processes;

4) Used for reliability evaluation of electronic components;

5) Used for delivery inspection and arrival inspection of electronic components;

6) It is used to identify the authenticity of electronic components.

Destructive physical analysis (DPA) technology is the key technology to ensure the quality of components. It is mainly used for batch quality evaluation and quality control in the production process. During the production process of components and before the machine is put into operation after production, DPA analysis technology has very extensive and irreplaceable analysis advantages in measuring the quality level, quality consistency, reliability and production process of components. DPA analysis technology can find potential defects in product design, structure, material and process. The time when these defects "break out" and eventually lead to component failure is uncertain, It may just fail after getting on the machine, it may fail after current surge during working on the machine, or it may fail after changes in a certain environment, so its harm is very serious. DPA analysis is an important technical means developed to meet the increasing requirements of electronic systems for component reliability. It aims at improving the quality of components and ensuring the reliability of the whole electronic system.