Destructive physical analysis (DPA) of electronic components for component testing

Date：2022-05-12 15:16:03Views：1630

DPA detection (destructive physical analysis) is the whole process of verifying whether the design, structure, material and manufacturing quality of components meet the requirements of the intended use or relevant specifications, sampling according to the production batch of components, dissecting the samples, and a series of inspection and analysis before and after dissection. It can determine whether there may be quality problems of component batches that endanger the use and lead to serious consequences. DPA technology is widely used in military and civil electronic components. It is of great significance in procurement inspection, incoming inspection and quality monitoring in the production process.

Main functions of DPA detection:

1. For the purpose of preventing failure, prevent components with obvious or potential defects from being used on the machine.

2. Determine the deviations and process defects of components in the design and manufacturing process.

3. Inspect and verify the quality of the supplier's components.

4. Put forward batch processing opinions and improvement measures.

DPA test and analysis items:

1) External visual inspection

2) X-ray inspection

3) Ultrasonic examination C-sam

4) Slice cross section

5) Kaifeng de cap

6) SEM / EDS

7) Internal visual inspection

8) Pull test

9) Wire bonding strength

10) Chip adhesion strength

11) Chip shear strength

12) Terminal strength

13) Air tightness check

14) Physical check

15) Contact check

16) Sampling with microscopic

17) Particle collision noise PIND

18) Internal atmosphere content

DPA basis standard:

1) Gjb548b-2005 test methods and procedures for microelectronic devices

2) Gjb4027a-2006 destructive physical analysis method for military electronic components

3) Gjb360b-2009 test methods for electronic and electrical components

4) Gjb128a-97 test method for semiconductor discrete devices

5) General rules for quantitative analysis of electron microprobe and scanning electron microscope X-ray energy spectrum

6) Ipc-tm-6502.1.1 manual microsection method

7）EIA/ECA-469-DSTANDARD TESTMETHOD FOR DESTRUCTIVEPHYSICAL ANALYSIS (DPA) OF CERAMIC MONOLITHIC

8）MIL-STD-883H-2010 Test Methodsand Procedures forMicrocircuits

9）MIL-STD-1580B DESTRUCTIVE PHYSICAL ANALYSIS FORELECTRONIC , ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS

10）MIL-STD-750D Test Methods for Semiconductor Devices

Electronic components are an integral part of electronic products. Affected by the quality of electronic components, the quality and performance of electronic products will also change. In view of this situation, in order to improve the qualification rate and maintenance effect of electronic products, the electronic components can be dissected and compared with the design with the help of destructive analysis of electronic components, and then the test results can be obtained. According to the destructive analysis of electronic components, it can improve the overall performance of electronic components and promote the development of related industries.