How to conduct IC failure analysis? Third party quality inspection organization

Date：2022-04-26 14:50:53Views：996

Failure analysis can find out the failure position, failure cause and mechanism of IC chip, so as to provide product improvement direction and suggestions to prevent problems. It can find out the failure cause and preventive measures for designers, producers and users. Failure analysis provides basis for improving product design and material selection, and prevents or reduces fracture accidents; Reliability can also be predicted by failure analysis; It can improve the reputation of mechanical products and play the role of technical feedback.

The significance of failure analysis is mainly reflected in the following aspects: failure analysis is a necessary means to determine the chip failure mechanism. Failure analysis provides necessary information for effective fault diagnosis. Failure analysis provides necessary feedback information for design engineers to continuously improve or repair the chip design and make it more consistent with the design specification. Failure analysis can evaluate the effectiveness of different test vectors, provide necessary supplements for production testing, and provide necessary information basis for verification and test process optimization.

Main steps and contents of failure analysis:

Chip unsealing:Remove the IC sealant, keep the chip function intact, and keep die, bond pads, bond wires and even lead frame from damage, so as to prepare for the next chip failure analysis experiment.

SEM / SEM / EDX composition analysis:Including material structure analysis / defect observation, element composition, conventional micro area analysis, accurate measurement of component size, etc.

Probe test:Quickly and conveniently obtain the internal electrical signal of IC with microprobe. Laser cutting: cutting a line or a specific area on the upper layer of a chip with a micro laser beam.

Emmi detection:Emmi low light level microscope is a highly efficient failure analysis tool, which provides a highly sensitive and non-destructive fault location method. It can detect and locate very weak luminescence (visible light and near-infrared light), so as to capture the visible light of leakage current caused by various component defects or abnormalities.

OBIRCH application (laser beam induced impedance value change test):OBIRCH is commonly used for high impedance and low impedance analysis inside the chip and line leakage path analysis. Using OBIRCH method, defects in the circuit can be located effectively, such as holes in lines and holes under through holes. The high resistance area at the bottom of the through hole can also effectively detect short circuit or leakage, which is a powerful supplement to the luminescence microscopy technology.

LG LCD hot spot detection:The liquid crystal is used to sense the arrangement and reorganization of molecules at the IC leakage, showing a mottled image different from other areas under the microscope, so as to find the leakage area (fault point exceeding 10mA) that puzzles the designer in the actual analysis.

Fixed / non fixed point chip grinding:Remove the gold bump planted on the LCD driver chip pad and keep the pad intact for subsequent analysis or rebinding.

X-ray nondestructive testing:Detect various defects in IC package, such as layer peeling, burst, cavity and integrity of wiring, possible defects in PCB process, such as poor alignment or bridging, open circuit, short circuit or abnormal connection, and integrity of solder ball in package.

Sam (SAT) ultrasonic flaw detection can carry out non-destructive detection on the internal structure of IC packaging, and effectively detect all kinds of damage caused by water vapor or heat energy, such as: O delamination of wafer surface, O cracks in tin ball, wafer or glue filling, O pores in packaging materials, O various holes, such as holes at wafer joint surface, tin ball, glue filling, etc.

The above is the relevant content of IC failure analysis of chip compiled by Chuangxin detection small. I hope it will be helpful to you. Chuangxin testing is a professional testing organization for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP and so on. Specializing in functional testing of electronic components, incoming appearance testing of electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components and RoHS component analysis testing. Welcome to call, we will serve you wholeheartedly!