What are the chip test methods? Reliability test of electronic products

Date：2022-04-12 13:58:00Views：2058

The quality of chip mainly depends on market, performance and reliability factors. Firstly, in the early stage of chip development, the market needs to be fully studied to define the spec to meet the needs of customers; The second is performance. The circuit designed by IC design engineers needs to pass designer simulation, DFT circuit verification, laboratory sample evaluation and FT, and it is considered that the performance meets the requirements of early definition; The last is reliability. Because the test chip can only ensure that the customer gets the sample for the first time, a series of stress tests need to be carried out to simulate the impact of some strict service conditions on the chip, so as to evaluate the service life and possible quality risk of the chip.

Reliability technology concept

Reliability is the ability of a product to display a specific function at a specific time under standard technical conditions. Reliability is to measure the possibility of failure, failure rate and product repairability. According to the technical specifications of products and customer requirements, we can implement reliability tests of different specifications, such as MIL-STD, JEDEC, IEC, jesd, AEC, andeia, etc.

Type of testing machine

High temperature storage test (HTST)

Low temperature storage test (ltst)

Temperature & humidity storage test (thst)

Temperature & humidity bias test (THB)

High temperature steam pressure test (PCT / ub-hast)

High accelerated temperature and humidity test

Temperature cycling test (TCT)

Temperature shock test (TST)

High temperature life test (HTOL)

High temperature bias test (BLT, biaslifetest)

Reflow test

Technical principle

Reliability can be defined as the possibility of implementing specific functions and successfully achieving work objectives within a certain time under specific service environment conditions. The most direct environmental factors affecting reliability include temperature change, temperature, humidity, mechanical stress, voltage and so on. Reliability test is mainly aimed at components in various environments to accelerate the aging and failure of components, so as to improve design, material or process parameters.

Environmental test

High temperature storage test: accelerate the aging of components at high temperature. It can stabilize electrical performance and detect surface and combined defects.

Low temperature storage test: at extremely low temperature, expansion and contraction will lead to mechanical deformation. Cracks caused by structural embrittlement of parts.

Temperature humidity storage test: accelerate chemical reaction and cause corrosion in high temperature and humid environment. Test the corrosion resistance of components.

High temperature steam pressure test / high accelerated temperature and humidity test (high accelerated temperature and humidity test): the principle is the same as that of temperature and humidity storage test. The difference is that the pressure in the humidification process is greater than the atmospheric pressure, accelerating the corrosion rate, resulting in the internal corrosion of poorly packaged products.

Temperature cycling test: use the difference of expansion coefficient to make the parts alternate several cycles of cold and heat, which will have an impact on the components. It can be used to eliminate parts that fail due to temperature changes such as grain, wiring and packaging.

Thermal shock test: the principle is basically the same as that of temperature cycle test, but the difference is to accelerate the temperature change. Measuring the resistance of electronic parts exposed to extreme high and low temperatures can detect defects such as packaging sealing, grain bonding, wiring bonding, matrix cracks and so on.

High temperature operating life test: use high temperature and voltage to accelerate aging, plus signal entry to simulate the functional state of components. The long-term operating life of IC products is evaluated by short-term experiments.

In the precondition test, perform the procedures of function measurement, appearance inspection, ultrasonic scanning (SAT), temperature cycling, bake and moisturesoak. The changes of transportation, storage, reflow, etc. experienced by the simulated components before use shall be treated as other reliability test pre-treatment.

Transportation test

Vibration test: simulate the vibration environment generated during ground transportation or product operation. The vibration behavior accelerates the deterioration of the original defects in the component structure, resulting in the failure of the component mechanism.

Mechanical shock test: slide the test piece down the inclined slide rail and collide with the obstacles at the bottom to produce impact.

Reliability has been listed as an important quality index for evaluating and testing products. For a long time, people only use the technical performance index of products as the symbol to measure the quality of electronic components, which only reflects one aspect of product quality, and can not reflect the whole picture of product quality. Because if the product is unreliable, no matter how good the technical performance is, it can't play a role.

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