Can X-ray of IC chip defect detection identify true and false chips?

Date：2022-04-01 16:50:51Views：1159

Chip R & D and manufacturing is one of the important high-tech technologies. Through the change of chip technology, the technical content of electronic products has been improved. However, after the chip is packaged, its internal structure cannot be checked by naked eyes. For such precision products, there are often fake and shoddy defects. So, can X-ray technology identify true and false chips? In order to help you better understand, this paper will summarize the defect detection of IC chip.

X-ray detection technology can be divided into four categories: quality detection, thickness measurement, article inspection and dynamic research. Quality inspection is widely used in casting, defect detection in welding process, industry, lithium battery, electronic semiconductor and other fields. The thickness gauge can be used for on-line, real-time and non-contact thickness measurement. Cargo inspection can be used for airport, station, customs inspection and structural size determination. Dynamics can be used to study dynamic processes such as trajectory, explosion, nuclear technology and casting technology.

X-ray can not only detect invisible chip solder joints or fracture defects, but also qualitatively analyze the test results. General electronic components and other products can be tested.

There are hundreds of chips on a wafer. After the wafer is produced, it should be tested and marked with bad ones; The tested wafers are cut and packaged. After packaging, we see the chip with pins. The chip marked as bad in the packaging stage will also be discarded. The chips that fail to pass the test are recycled by the manufacturer who bought the bare chips, cut and bound by himself, but the chips marked as bad will also be discarded.

Usually, the formal testing process is time-consuming and costly, so some wafer factories will sell untested wafers to manufacturers who need bare chips, and the latter will test them themselves. However, the latter usually does not have good test equipment. At the same time, in order to save money and reduce test items, some chips that could not pass in the semiconductor factory are used in the final products, resulting in the instability of product quality.

X-ray technology will not damage the detected object, which is convenient and practical. It can achieve the unique detection effect that other detection methods can not achieve. With the discovery, application and development of X-ray technology, a large number of applications of X-ray detection can be seen in various industries. In addition, X-ray can also detect the internal cracks and foreign matter defects of plastic materials and parts, electronic components and LED components, and analyze the internal displacement of BGA and circuit board; Identify BGA welding defects such as empty welding and false welding, and the internal conditions of microelectronic system and adhesive sealing components, cables, fittings and plastic parts.

The above is the relevant content of the X-ray technology in IC chip defect detection. I hope it will be helpful to you. Chuangxin testing is a professional testing organization for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP and so on. Specializing in functional testing of electronic components, incoming appearance testing of electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components and RoHS component analysis testing. Welcome to call, we will serve you wholeheartedly!