Introduction to reliability test of electronic products

Date：2022-03-31 17:11:46Views：1209

When it comes to electronic components, everyone should be familiar with them. What about the reliability of electronic components? The reliability of electronic components is an important factor affecting the reliability of products. Engineers need to select electronic components in circuit design, an essential part of which is the reliability of electronic components, and the inherent reliability of electronic components is the most easily ignored. Therefore, in order to ensure the reliability of products, we must ensure the reliability of electronic components.

Mechanical integrity test items

1. Mechanical shock: determine whether optoelectronic devices can be used in electronic equipment subject to medium severity shock. The impact may be caused by sudden stress or violent vibration during loading, unloading, transportation or on-site use.

2. Variable frequency vibration: determine the impact of vibration on various components of optoelectronic devices within the specified frequency range.

3. Thermal shock: determine the resistance and function of optoelectronic devices when subjected to temperature upheaval.

4. Plugging durability: determine whether the optical power, loss, reflection and other parameters of optical fiber connector of optoelectronic devices meet the repeatability requirements.

5. Storage test: determine whether optoelectronic devices can withstand high temperature and low temperature transportation and storage.

6. Temperature cycle: determine the ability of optoelectronic devices to withstand extremely high temperature and extremely low temperature, and the impact of alternating changes of extremely high temperature and extremely low temperature on optoelectronic devices.

7. Constant damp heat: determine whether sealed and unsealed optoelectronic devices can withstand the specified temperature and humidity at the same time.

8. High temperature life: determine the high temperature accelerated aging failure mechanism and working life of optoelectronic devices.

Accelerated aging test

High temperature, high humidity and certain driving current are applied to optoelectronic devices to accelerate aging. According to the test results, the optoelectronic devices can be judged to have function and loss of function, as well as acceptance and rejection, and the working conditions of optoelectronic devices can be adjusted and the reliability can be calculated.

1. High temperature accelerated aging: the basic environmental stress high temperature in the process of accelerated aging. During the experiment, the selected parameters shall be monitored regularly until the degradation exceeds the end of life.

2. Constant temperature test: the constant temperature test is similar to the high-temperature operation test. The number of samples and allowable failure number of constant temperature test shall be specified.

3. Variable temperature test: the high temperature accelerated aging test with variable temperature is to increase the temperature regularly and gradually in sequence (for example, 60 ℃, 85 ℃ and 100 ℃)

4. Temperature cycling: in addition to the temperature cycling of optoelectronic devices as an environmental stress test, temperature cycling can also accelerate the aging of tube electronic devices. The accelerated aging of temperature cycle is generally not to cause the degradation of specific performance parameters, but to provide additional instructions on the long-term mechanical stability of the optical path encapsulated in the component.

Physical property test items

1. Internal water vapor: determine the water vapor content in the gas inside the optoelectronic device encapsulated in metal or ceramic.

2. Tightness: determine the air tightness of optoelectronic device package with inner cavity.

3. ESD broad value: determine the sensitivity and sensitivity of optoelectronic devices to damage and degradation caused by electrostatic discharge.

4. Flammability: determine the flammability of materials used in optoelectronic devices.

5. Shear force: determine the integrity of materials and processes used by chips and passive components of optoelectronic devices installed on sockets or other substrates.

6. Solderability: determine the solderability of optoelectronic device leads (leads with diameter less than 30175mm and flat leads with equivalent cross-sectional area).

7. Wire bonding strength: determine the wire bonding strength of optoelectronic devices using low-temperature welding, hot pressing welding, ultrasonic welding and other technologies.

In short, there are many kinds of products that need to be tested for reliability. Enterprises will have different testing needs according to different needs, and they can test according to the characteristics of their own products.