Failure analysis of electronic components

Date：2022-03-09 14:30:00Views：869

Most of the faults in electronic equipment are ultimately caused by the failure of electronic components. If you are familiar with the failure causes of components and locate the failure causes of components in time, you can eliminate the faults in time and make the equipment operate normally. The rapid development of electronic component technology and the improvement of reliability have laid the foundation of modern electronic equipment. The fundamental task of component reliability is to improve the reliability of components.

Failure analysis method of electronic components

1. Pull out insertion method

Pull out and insert method refers to monitoring the process of pulling out and inserting the component board or plug-in board, and judging whether the connection interface pulled out and inserted is the place where the fault occurs. It is worth noting that when the pull-out and insertion method is used for failure analysis, there will be special conditions in the process of pulling out and inserting the component board or plug-in board, that is, the place where the state changes is sometimes not only the connection interface, but also other parts. Therefore, when applying the pull-out insertion method, we should pay attention to observe each part and subtle changes in order to make a correct judgment.

2. Sensory discrimination

Sensory discrimination is the way to judge whether there is abnormality by observing the shape of parts, sensing the temperature and hardness of parts by hand touch, nose smell and smell, and ear hearing sound. Sensory discrimination method is simple and economical, but the content that can be distinguished will be restricted by sensory ability.

3. Power pull bias method

The power supply biasing method refers to biasing the normal power supply and voltage to make it in an abnormal state, and then exposing weak links or faults, so as to reflect the faulty or near faulty components and components. This method is generally used in the case of fault caused by long working time or preliminary judgment that the fault is caused by power grid fluctuation. It is worth reminding that the power pull bias method is destructive. Before using this method, you must check the insurance coefficient or other factors, and remember not to use it casually.

4. Replacement of spare parts

By monitoring the removed suspicious components or parts, and then replacing the qualified spare parts, compare and analyze the fault phenomena. If the fault phenomenon disappears, finally determine whether the fault source point is in the removed parts. This method is the method of replacing the spare parts.

Common means

Electrical measurement:Connectivity test # electrical parameter test function test

NDT:

Unsealing Technology (mechanical unsealing, chemical unsealing, laser unsealing)

Passivation layer removal technology (chemical corrosion passivation layer removal, plasma corrosion passivation layer removal, mechanical grinding passivation layer removal)

Micro area analysis technology (FIB, CP)

Sample preparation technology:

Unsealing Technology (mechanical unsealing, chemical unsealing, laser unsealing)

Passivation layer removal technology (chemical corrosion passivation layer removal, plasma corrosion passivation layer removal, mechanical grinding passivation layer removal)

Micro area analysis technology (FIB, CP)

Micro morphology analysis:

Optical microanalysis Technology

Scanning electron microscope secondary electron image technology

Surface element analysis:

Scanning electron microscope and energy spectrum analysis (SEM / EDS)

Auger electron spectroscopy (AES)

X-ray photoelectron spectroscopy (XPS)

Secondary ion mass spectrometry (SIMS)

Nondestructive analysis technology:

X-ray fluoroscopy Technology

3D perspective technology

Reflective scanning acoustic microscopy (C-sam)

The main failure modes of electronic components include but are not limited to open circuit, short circuit, burning, explosion, electric leakage, function failure, electrical parameter drift, unstable failure, etc.