Understand the failure classification and failure mechanism of electronic components

Date：2022-02-23 16:27:27Views：1225

The development history of electronic components is actually a brief history of electronic development. Electronic technology is a new technology. In the 20th century, it has developed the fastest and used the most widely. It has become an important symbol of the development of modern science and technology. In order to promote the further development of electronic information technology, it is necessary to improve the reliability of electronic components. Therefore, it is very necessary to master the technology of failure analysis of electronic components.

Electronic components mainly include components and devices. Electronic components are finished products whose molecular components are not changed during production and processing, such as capacitance, resistance and inductance. Electronic devices are finished products whose molecular structure changes in the process of generation and processing, such as electron tubes, integrated circuits, etc.

Classification of failures

According to different standards, the classification of failure generally includes the following classification methods.

Take the failure cause as the standard: it is mainly divided into essential failure, misuse failure, accidental failure, natural failure, etc.

Take the failure degree as the standard: it is mainly divided into partial failure and complete failure.

Take the failure mode as the standard: mainly divided into no function, short circuit, open circuit, etc.

Based on the severity of failure consequences: it is mainly divided into mild failure, serious failure and fatal failure.

In addition to the above, there are a variety of classification standards, such as taking failure occasions and failure external performance as standards, which are not repeated here.

Failure mechanism

The failure mechanisms of electronic components also have different classifications, usually based on their causes, which can be divided into the following failure mechanisms.

① Surface deterioration: sodium ions of components are polluted, resulting in leakage in the channel γ Radiation damage, surface creep or breakdown, etc; ② Deterioration caused by design problems: refers to the design problems in the circuit, layout and structure of single components; ③ Internal deterioration: refers to instantaneous power overload and structural performance degradation caused by CMOS locking effect, secondary breakdown, heavy metal contamination, neutron radiation damage and material problems; ④ Damage caused by improper use: refers to electrical surge damage, electrostatic damage, damage caused by excessive temperature, failure caused by interference signal, etc; ⑤ Deterioration of metallization system: refers to aluminum electromigration, aluminum corrosion, aluminum notch, etc. in electronic components; ⑥ Package deterioration: refers to corrosion of pipe legs, air leakage or short circuit or electric leakage caused by foreign objects in the shell [3].

Main failure modes of electronic components

Open circuit, short circuit, burning, leakage, function failure, electrical parameter drift, unstable failure, etc.

Routine inspection of electronic components

Take the grain chip layer, remove the gold removal bump, dye and take high-resolution micrograph

Scanning electron microscope was used to examine the high / low order fixed-point cross-section cutting probe, which was measured by I-V curve

Back grinding X-ray fluoroscopy ultrasonic scanning examination (C-sam)

The above is about the failure classification and failure mechanism of electronic components compiled by Chuangxin testing group. I hope it will be helpful to you. Chuangxin testing is a professional testing organization for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP and so on. Specializing in functional testing of electronic components, incoming appearance testing of electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components and RoHS component analysis testing. Welcome to call, we will serve you wholeheartedly!