IC cover opening detection refurbished chip authenticity identification

Date：2022-02-17 18:00:00Views：1177

Chip mainly refers to integrated circuit, also known as microcircuit, also known as microchip. Nowadays, chips have become indispensable to us. The essence of chip is semiconductor plus integrated circuit. It is a kind of micro circuit with special functions, which miniaturizes the circuit and makes it on a semiconductor wafer. Because the chip is small in size and does not occupy space in electronic products, it can make electronic products light and thin, and can also play a high performance and role. It can be said that a chip is like the heart or brain of an electronic device. It can not only carry out logic control, but also have computing ability.

As an engineer, you need to have a basic understanding of integrated circuits. Usually, the data book can provide a lot of information about the chip. If you want to design reliable, low-power and high-performance products, you can't stay in the data book. You need to deeply study the internal working principle of IC, the relationship between its manufacturing process and its performance, and have a certain ability to analyze IC.

When analyzing the internal chips, wires and components during chip failure analysis, due to the blocking observation of packaging colloid, the combination of "laser etching" and "wet etching" is used to open the cover and remove the glue (compound removal), so as to expose the coated objects in the package for subsequent relevant experimental treatment and observation.

Principle of opening cover and cap of components: remove the package on the surface of components by using chemical or physical methods, and observe the connection of leads inside components.

Chip packaging materials

A chip usually consists of the following structures:

1. Conductor rack. It is made of metal and used to connect silicon wafer and circuit board.

2. Plastic or ceramic shell. Made of plastic or ceramic, usually black or white, to protect silicon wafers.

3. Connecting wire between wafer and wire rack. It is composed of gold wire or aluminum wire, which is used to connect silicon wafer and conductor frame.

4. Silicon wafer. It is composed of high-purity silicon, dopant and metal. It is the core component of integrated circuit.

5. Cooling base. Made of metal, the silicon wafer is glued to the heat dissipation base.

The removal methods of these materials can be removed manually by chemical methods such as dilute hydrochloric acid and dilute sulfuric acid, but the artificial chemical method is easy to cause corrosion and damage to the chip materials.

The best practice to avoid the risk of fake goods flowing in is to purchase components through formal channels and take photos of each batch of purchased products for retention. It costs a lot to buy fake goods or fake goods. The problems in the early development stage are all good. I'm afraid that the problems will be found only after mass production. Today, with such a high level of counterfeiting, it is difficult for even the engineers of the original factory to distinguish the true from the false with the naked eye. Usually, experienced original engineers may see the difference between real and fake products through familiar packaging methods and bar codes, but they have to rely on advanced laboratory instruments to really determine whether they are fake chips.