What other applications do x-ray devices have for IC chip detection?

Date：2022-01-20 17:48:00Views：1058

In recent years, the progress of science and technology makes the X-ray detection equipment used in production more strict. Crankshaft, cylinder, engine blade and other industrial parts also use castings. The production of castings is very easy to produce bubbles and other problems, which can not be solved by traditional technology. However, the nondestructive testing technology of X-ray testing equipment has obtained very accurate results in the testing of various castings, has a wide range of applications, and the technology is mature.

What is the X-ray detection equipment?X-ray detection equipment is a flaw detection equipment with ray source and detector as the core. The ray source penetrates the sample to be tested by emitting X-rays, and then the detector collects the light penetrated from the sample and transmits the integrated dark spots to the display to achieve the purpose of real-time observation of products.

What can X-ray detection equipment detect?

X-ray detection equipment is widely used in industrial fields, such as IC chips, electronic components, semiconductors, connectors, plastic parts, BGA, led, SMT, capacitors, circuit boards, lithium batteries, etc. it is mainly used to check whether the welding points are broken, short circuited, whether the welding is normal (air welding and false welding), whether the internal deformation, whether the gold wire is normally connected, etc; In ceramics and castings, it mainly depends on whether there are bubbles and cracks in the workpiece.

What are the applications of X-ray detection equipment?

1. With the rise of intelligent terminal equipment and intelligent automotive electronic products, the miniaturization of packaging, the high-density of assembly and various new packaging technologies become more and more perfect. The proportion of X-ray used to detect quality in circuit assembly is becoming larger and larger.

2. Other technologies such as automatic optical testing, ICT needle bed testing, functional testing (FCT) and X-ray testing are widely used in SMT, led, BGA, CSP flip chip testing, semiconductor, packaging components, lithium battery industry, electronic components, auto parts, photovoltaic industry, aluminum die casting, molding plastics, ceramic products and other special industries.

3. After the acceleration of the development of electronic components in the direction of refinement, miniaturization and complexity, many enterprises engaged in electronic manufacturing usually choose X-ray testing equipment as a strong support for enterprise testing in order to reduce product defects and ensure the yield.

This trend is not necessarily because PCB components need to become smaller, but because the new design greatly adopts more ball grid array packages (BGA) and other devices that hide welded connections, such as square flat pinless package (QFN) and column grid display package (LGA). Compared with larger leaded packages, such devices usually have certain advantages in performance and cost, so the trend of smaller and denser may continue.

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