How to distinguish between true and false IC products? Inspection process of IC inspection company

Date：2022-01-18 14:24:00Views：1428

When it comes to chips, we all know that this is a very high-tech and professional field, and the whole production process is particularly complex. Goods on the market generally go through three stages: design, manufacturing and packaging. Integrated circuit chip is an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic base to make a chip. IC chip includes wafer chip and packaging chip. The corresponding IC chip production line is composed of wafer production line and packaging production line. How to distinguish between true and false IC products? Let's introduce it to you.

1. Observe whether the chip surface has been polished

For polished chips, there will be fine lines on the surface, even traces of previous printing. In order to cover up the old surface, a thin layer of material is coated on the chip, which looks shiny and lacks the texture of plastic.

2. Observe the printed handwriting

Now the vast majority of chips are marked by laser or printed by special chip printing machine. The handwriting is clear, inconspicuous, fuzzy and difficult to erase. The refurbished chip either has a serrated feeling due to the corrosion of the writing edge by the cleaning agent, or the printing is fuzzy, different in depth, incorrect in position, easy to erase or too conspicuous. In addition, the silk screen printing process has long been eliminated from the current IC manufacturers, but many chip renovations still use the silk screen printing process due to cost reasons, which is also one of the judgment basis. The words printed on the silk screen will be slightly higher than the chip surface, and you can feel slight unevenness or astringency by touching with your hand.

3. Observe whether the pin is old or new

All tinned pins as bright as new must be refurbished. The vast majority of the pins of genuine IC should be so-called silver powder pins, with dark color but uniform color, and there should be no oxidation trace or flux on the surface. In addition, the pins of dip and other plug-ins should not be scratched. Even if there are (repackaging will be) scratches, they should be neat and in the same direction, and the metal exposure should be smooth and free of oxidation.

4. Measure device thickness and detect device edge

Many of the original laser printing polished and renovated pieces (mostly power devices) must be polished deeply to remove the original mark. In this way, the overall thickness of the device will be significantly less than the normal size, but it is difficult for people with insufficient experience to distinguish without comparison or caliper measurement. However, there is an alternative way to see through, that is, to look at the front edge of the device. Because the plastic encapsulated device must be demoulded after injection molding, the edge angle of the device is round (R angle), but the size is small. During grinding, it is easy to grind this fillet into a right angle. Therefore, once the front edge of the device is at a right angle, it can be judged as polished goods.

In fact, it is really difficult to distinguish the true and false chips. It is recommended that you still find a regular chip testing company for verification. At present, the detection services provided by the third party usually include reliability analysis (RA), failure analysis (FA), wafer material analysis (MA), signal testing, chip circuit modification, etc., of which the more important ones include reliability analysis, failure analysis, etc. If you have any needs related to the inspection and testing of electronic products, please call Chuangxin testing, and we will serve you wholeheartedly.