Incoming inspection standards for various electronic components (very detailed here)
Date:2022-01-17 13:31:00Views:2730
The key work of electronic product development is the design of principle realization, component (material) selection, verification and testing, etc. Incoming inspection of components is a very important part and the source of quality management. As the saying goes, "everything is difficult at the beginning". Therefore, only by controlling the source, the subsequent production will be relatively easy. Select appropriate suppliers according to the function and processing technology of product parts to ensure the quality of parts and save costs.
No. | Material name | Inspection items | Test method: in the light 1m-1.2m away from the 40W fluorescent lamp, the distance between the eyes and the object is 20-30cm, and the viewing time is about 3-5 seconds | ||||
1 | resistance | 1. Dimensions | a. The allowable tolerance range of length / width / height of SMT parts is+0.2mm | ||||
b. The allowable tolerance range of dip part length / diameter (round body) / foot diameter is+0.25mm | |||||||
2. Appearance | a. The body shall be free from damage or serious body contamination | ||||||
3. Packing | a. The packing method is bag or plate | ||||||
4. Electrical | a. The measured volume value must be consistent with the marked and corresponding product BOM requirements | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the color ring shall not fall off or deviate by 1 / 4 of its original position | ||||||
2 | capacitance | 1. Dimensions | a. The allowable tolerance range of length / width / height of SMT parts is+0.2mm | ||||
b. The allowable tolerance range of dip part length / diameter (round body) / foot diameter is+0.25mm | |||||||
2. Appearance | a. The model, specification and direction of the body shall be clear and correct | ||||||
3. Packing | a. The packing method is bag or plate | ||||||
4. Electrical | a. The measured resistance value must be consistent with the mark and the corresponding product BOM requirements | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the silk screen printing shall not be seriously blurred and its specification cannot be identified | ||||||
3 | Diode (rectifier regulator) | 1. Dimensions | a. The allowable tolerance range of length / width / height of SMT parts is + 0.2mm | ||||
b. The allowable tolerance range of dip part length / diameter (round body) / foot diameter is+0.25mm | |||||||
2. Appearance | a. The model, specification and direction of the body shall be clear and correct | ||||||
3. Packing | a. The packaging method is disc, tape or bag | ||||||
4. Electrical | a. Use a multimeter to measure its positive and negative polarity, which shall be consistent with the mark, and there shall be no open or short circuit | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the silk screen printing shall not be seriously blurred and its specification cannot be identified | ||||||
4 | light-emitting diode | 1. Dimensions | a. The allowable tolerance range of length / width / height of SMT parts is+0.2mm | ||||
b. The allowable tolerance range of dip part length / diameter (round body) / foot diameter is+0.25mm | |||||||
2. Appearance | a. The transparency and color of the tube must be uniform and consistent | ||||||
3. Packing | a. The packing method is bag or plate | ||||||
4. Electrical | a. Measure the polarity corresponding to the length of the foot (generally, the long foot is positive and the short foot is negative) | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the pipe body has no discoloration and outer layer peeling | ||||||
5 | triode | 1. Dimensions | a. The three terminal pin spacing must be uniform, and the allowable tolerance shall not exceed 0.2mm | ||||
2. Appearance | a. The printing model shall be free of errors, and the silk screen printing shall be clear and easy to identify | ||||||
3. Packing | a. The pasted parts must be installed in disk (no interruption or few are allowed) | ||||||
4. Electrical | a. Measure the polarity of the pin and ensure that there is no open circuit or short circuit between the pins | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the silk screen printing shall not be seriously blurred and its specification cannot be identified | ||||||
6 | IC | 1. Dimensions | a. The length / width / thickness / foot distance dimension shall not exceed the tolerance range of the drawing | ||||
2. Appearance | a. The surface silk screen printing shall be clear and legible, and the contents and marks shall be clear and correct | ||||||
3. Packing | a. The outer package shall be marked with obvious items and shall be consistent with the real object | ||||||
4. Electrical | a. The storage and reading function of the copy machine shall be consistent with the model, and it can copy the content or refresh and recopy as OK | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the silk screen shall not be seriously blurred or unrecognizable | ||||||
7 | Crystal oscillator | 1. Dimensions | a. The height / foot distance dimension shall not exceed the tolerance range of the drawing | ||||
2. Appearance | a. The screen printing of the table body shall be clear and legible, and the model and direction shall be marked correctly, and it shall not fall after ultrasonic cleaning, so it is unclear and its specification cannot be distinguished | ||||||
3. Packing | a. The packaging must be sealed with tape | ||||||
4. Electrical | a. Measure that there is no open circuit or open circuit between its pins | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the silk screen does not fall, blurred and indistinguishable | ||||||
8 | Transformer | 1. Dimensions | a. The length / width / foot distance dimension shall not exceed the tolerance range of the drawing | ||||
2. Appearance | a. The surface silk screen printing shall be clear and legible, and the model and direction marks shall be clear and correct | ||||||
3. Packing | a. The outer package shall be marked with obvious items and shall be consistent with the real object | ||||||
4. Electrical | a. The primary / secondary coils shall be free of open circuit or inconsistent resistance (according to the sample) | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the screen printing is free of falling, blur and unrecognizable, and the protective film is free of wrinkling and peeling | ||||||
9 | Inductive magnetic bead | 1. Dimensions | a. Allowable tolerance range of length / width / height of SMT parts+0.2mm | ||||
b. The allowable tolerance range of dip part length / diameter (round body) / foot diameter is+0.25mm | |||||||
2. Appearance | a. The color ring marking of inductance must be clear and correct | ||||||
3. Packing | a. The outer package shall be marked with obvious items and shall be consistent with the real object | ||||||
4. Electrical | a. The coil shall be free of open circuit | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the color ring shall not fall off or deviate by 1 / 4 of its original position | ||||||
10 | relay | 1. Dimensions | a. The length / width / height / foot distance dimension shall not exceed the tolerance range of the drawing | ||||
2. Appearance | a. The surface silk screen printing shall be clear and legible, and the model and content shall be clear and correct | ||||||
3. Electrical | a. Measure each on / off contact and coil resistance, which must be consistent with the corresponding model | ||||||
4. Packing | a. The outer package shall be marked with obvious items and shall be consistent with the real object | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
11 | wave filter | 1. Dimensions | a. Allowable tolerance range of length / width / height / foot distance of SMT parts + 0.2mm | ||||
2. Appearance | a. The printing screen printing shall be clear and legible, and the content and direction marks shall be correct | ||||||
3. Packing | a. The outer package shall be marked with obvious items and shall be consistent with the real object | ||||||
4. Electrical | a. Weld with the corresponding product for computer test, and the overall function is OK (refer to the test standard) | ||||||
5. Tin dipping | a. The solderability area of pins shall not be less than 75% | ||||||
6. Cleaning | a. After ultrasonic cleaning, the silk screen shall not be seriously blurred or unrecognizable | ||||||
12 | USB head socket | 1. Dimensions | a. The length / width / foot distance / hole size shall not exceed the tolerance range of the drawing | ||||
2. Appearance | a. The body shall be free of defects, scratches and deformation | ||||||
3. Packing | a. The outer package shall be marked with obvious items and shall be consistent with the real object | ||||||
4. Electrical | a. Measure the on and off contact of each pin, and the conductivity must be good | ||||||
5. Tin dipping | a. Solderability of welding end / pin shall not be less than 90% | ||||||
6. Cleaning | a. The body shall be free of corrosion marks and corrosion after cleaning | ||||||
7. Trial assembly | a. There is no mismatch with the corresponding accessories | ||||||
13 | Laser module | 1. Dimensions | a. The length / width / positioning dimension shall not exceed the tolerance range specified in the structural drawing | ||||
2. Appearance | a. Sr / SC terminals of board power supply must be clearly marked, the board surface must be clean, and the components must be free of damage and deformation | ||||||
3. Packing | a. The veneer must be packed in anti-static bags and placed in boxes with paper cushion | ||||||
4. Electrical | a. Measuring the power of the laser module must be consistent with the power parameter range of the corresponding product | ||||||
14 | Key switch | 1. Appearance | a. The pins shall be free from oxidation, rust, fracture and distortion | ||||
2. Structure | a. The on / off state of the grounding point is consistent with the switch switching | ||||||
15 | PCB | 1. Line part | a. Open circuit and short circuit are not allowed in the circuit | ||||
2. Structure size | a. The dimensions and specifications shall be in accordance with the forming dimensions specified in the letter of acceptance, and the clear dimensions, thickness specifications and allowable tolerances shall be marked in the drawing | ||||||
3. High temperature test | a. After reflow soldering (180 ° C-250 ° C) of the base plate, the anti welding paint shall be free of blistering, peeling, deformation and discoloration, and the tin plate shall be free of tin marks, tin slag, contamination, etc | ||||||
4. Cleaning | a. After cleaning, there shall be no glue joint in the wire printing protective paint on the plate surface | ||||||
5. Packing | a. PCB incoming materials must be packed in vacuum (moisture-proof desiccant shall be attached) | ||||||