Application of IC chip on-line X-ray nondestructive testing technology

Date：2022-01-13 16:03:39Views：1224

In modern development, X-ray imaging technology has formed a relatively complete set of X-ray nondestructive testing technology system. "Nondestructive" as the name suggests, the test process will not damage the test piece. Its biggest feature is that it can test without damaging the material and structure of the test piece. Therefore, the use of nondestructive testing can implement 100% full product inspection to ensure production quality. This can be achieved by using Xray online detection technology, which can not only realize the detection of invisible solder joints such as BGA, but also conduct qualitative and quantitative analysis of the detection results, so as to find faults early.

X-ray nondestructive testing technology is divided into X-ray nondestructive testing technology and digital radiographic testing technology according to the different acquisition methods of workpiece inspection images. X-ray imaging technology has a long history, mature technology and wide application, which has laid a solid foundation for the development of other X-ray imaging technologies. Digital ray detection technology mainly includes X-ray real-time imaging technology, X-ray tomography CT imaging technology, X-ray micro CT imaging technology, X-ray cone beam CT three-dimensional imaging technology, Compton backscattering technology, etc.

Application of X-ray nondestructive testing instrument in lithium battery industry

According to the internal structure of lithium battery, the cathode is encapsulated in the anode, and the intermediate isolation belt is used to prevent short circuit between anode and cathode. If the finished battery is used, its internal structure cannot be detected, so it is appropriate to use nondestructive testing equipment. Checking whether the cathode and anode are aligned and ensuring the isolation state is the key to ensure the safety of subsequent monitoring data.

X-ray nondestructive testing instrument in semiconductor industry

At present, the commonly used wafer testing method is to peel the wafer layer by layer and then photograph the surface of each layer with an electron microscope. This testing method has great damage to the wafer. At this time, X-ray nondestructive testing technology may help. The X-ray detector for electronic devices mainly uses X-rays to irradiate the inside of the chip. Due to the strong penetration of X-rays, it can image after penetrating the chip, and the fracture of its internal structure can be clearly displayed. The main feature of detecting the chip with X-rays is that there is no damage to the chip itself. Therefore, this detection method is also called nondestructive testing.

Application of X-ray nondestructive testing instrument in the field of public safety

Public security inspection station is a comprehensive inspection method, which can realize the separation of people and vehicles, enter the X-ray inspection area after vehicle license plate recognition, and the driver and passengers enter the X-ray inspection area. It is a comprehensive inspection method, which is applicable to important traffic fortresses, border inspection, customs and other important traffic arteries, border defense, customs and other places. The driver and passengers enter the inspection port and check with the passengers, And take it away from the site. Such a series of safety inspection operations ensure the safety of vehicles and passengers, and no matter how hard it is to find contraband, there will be no hiding.

Online X-ray nondestructive testing technology images the internal structure of the object through the absorption difference of the object to the X-ray material, and then detects the internal defects. It is widely used in the fields of industrial flaw detection, testing, medical testing, safety testing and so on.

1. It can be used to detect whether there are cracks and foreign matters in some metal materials and their components, electronic components or LED components.

2. Internal detection and analysis of BGA, circuit board, etc.

3. Detect and judge the broken wire, false welding and other defects in BGA welding.

4. It can detect and analyze the internal state of cables, plastic parts, microelectronic systems, adhesives and sealing components.

5. Used to detect bubbles, cracks, etc. of ceramic castings.

6. Check whether the IC package is defective, such as peeling, cracking, gap, etc.

7. The application of printing industry is mainly reflected in the defects, bridges and circuit breakers in the process of paperboard production.

8. In SMT, it is mainly to detect the gap between solder joints.

9. In integrated circuits, it is mainly to detect open circuit, short circuit or abnormal connection in various connecting wires.

In terms of development trend, it should be led by radiographic inspection, especially X-ray real-time imaging detection technology. 2D and 3D technologies are becoming more and more mature. Two-dimensional fault and three-dimensional are characterized by high detection accuracy and fast speed. We should know that any nondestructive testing method has its own advantages and disadvantages. Enterprises should use several testing methods as much as possible to learn from each other, so as to ensure the safe operation of pressure equipment.