What are the electronic failure analysis objects? Third party failure analysis and detection

Date：2022-01-05 14:55:00Views：1050

Failure analysis is a newly developed discipline, which has strong practical significance in improving product quality, technology development, improvement, product repair and arbitration of failure accidents. Comprehensive and systematic failure analysis can determine the cause of failure, guide the improvement of device design, manufacturing process, test or application, and take corresponding corrective measures to eliminate the cause of failure mode or mechanism, so as to improve the overall reliability of devices and equipment.

Through failure analysis, the inherent quality problems of failed components can be found, and the service quality problems of components that fail because they are not used according to the specified conditions can also be found. Through feedback to relevant parties, the responsible party can be prompted to take corrective measures, so as to eliminate the causes of the reported failure mode or mechanism and prevent its recurrence, It plays a very important role in improving the inherent quality or service quality of components.

Failure analysis object

★ various materials and parts (metal, plastic, ceramic, glass, etc.)

★ electronic components (resistance, capacitance, resistance network, inductance, relay, electrical connector, contactor, etc.)

★ semiconductor discrete devices (diode, triode, FET, thyristor, crystal oscillator, optocoupler, diode stack, IGBT, etc.)

★ electromechanical devices (relays, mechanical switches, MEMS)

★ cables and connectors (aviation connectors, various types of cables)

★ microprocessor (51 series single chip microcomputer, DSP, SOC, etc.)

★ programmable logic devices (Gal, pal, ECL, FPGA,, CPLD, EPLD, etc.)

★ memory (EPROM, SRAM, DRAM, MRAM, DDR, flash, nor flash, NAND flash, FIFO, etc.)

★ AD / DA (DAC7611, max525, ADC0832, ad9750, etc.)

★ general digital circuit (CMOS 4000 series, 54 series, 80 Series)

★ simulator (operational amplifier, voltage comparator, follower series, voltage controlled oscillator, sample holder, etc.)

★ microwave devices (frequency multiplier, mixer, receiver, transceiver, up converter, voltage controlled oscillator, amplifier, power divider, coupler, etc.)

★ power supply (linear voltage regulator, switching power converter, power monitor, power management, led, PWM controller, DC / DC, etc.)

Ceramic capacitor (wafer), ceramic chip capacitor (multilayer chip), mica capacitor, film capacitor, non solid electrolyte tantalum capacitor, solid electrolyte tantalum capacitor, chip solid electrolyte tantalum capacitor Common mode suppression inductor, ring inductor, crystal resonator, connector, electromagnetic relay, solid state relay, switch, optocoupler, interface transformer, pressure sensor, vacuum fluorescent tube IGBT, rectifier bridge stack, thyristor Module (power supply, power, microwave, etc.) Integrated circuit (small scale IC) Packaging (dip to, etc.) Integrated circuit (small and medium scale IC) Packaging (QFN \ QFP \ CSP, etc.) Memory, DSP, CPU, FPGA

Device category	Device subdivision category
Components (resistance capacitance sensing, switch, relay, fuse, connector, cable, etc.)	Metal film resistor, chip fixed resistor, metal foil fixed resistor, wire wound resistor, potentiometer, thermistor (temperature sensor)
Device / module	Diode, triode, MOS tube, Optocoupler

Failure analysis is of great significance to the production and use of products. Failure may occur at all stages of the product life cycle, involving product R & D and design, incoming material inspection, processing and assembly, test screening, client use and other links. By analyzing process waste products, early failure, test failure, pilot test failure and field failure samples, Confirm the failure mode, analyze the failure mechanism, clarify the failure causes, and finally give preventive countermeasures to reduce or avoid the recurrence of failure.