Xray circuit board detection can effectively solve the problem of false soldering

Date：2021-12-31 16:39:18Views：1197

At present, most of the electronic components commonly used in integrated circuits are sealed with epoxy resin or other glue and alloy, and there is often the phenomenon of circuit board false soldering. Therefore, detecting circuit board false soldering is a very important link.

Circuit board soldering has always been a common problem in the electronic industry. Due to the compact, complex internal structure and miniaturized shape of electronic products, ordinary testing instruments can not detect their internal defects. Therefore, it is difficult to solve the problem of how to effectively detect circuit board soldering. After many experimental studies, X-ray detection equipment has been recognized by more and more people, and its efficiency and effect of circuit board false soldering detection are both worry-saving and labor-saving.

Since the final result of the welding bridge is an electrical short circuit, there should be no welding bridge between adjacent solder balls after the circuit board device is welded. When detected by X-ray detection equipment, the defect is more obvious. The continuous connection between solder balls can be seen in the image area, which is convenient for observation and judgment. It can also detect false welding defects by rotating the X-ray angle, so as to take effective measures to avoid them in time.

When the X-ray detection equipment transmits the circuit board, the part of the circuit board with faulty welding, the broken part of the circuit board, or the hollow part of the circuit board will have different X-ray absorption capacity due to the different distribution density of solder metal. Because the ray intensity penetrating the defective part is higher than that of the non defective part, the parts of circuit board faulty welding, circuit board cavity and circuit board fracture can be detected by detecting the difference of ray intensity penetrating the object.

Using X-ray detection equipment to detect the welding quality of BGA devices is an economical and effective method. With the development of new technology, high-resolution and intelligent bag detection equipment can not only provide time-saving, labor-saving and reliable guarantee for bag equipment assembly, but also play an important role in electronic product fault analysis and improve the efficiency of fault diagnosis.