What are the factors affecting chip reliability? What are the national standards?

Date：2021-12-29 14:27:16Views：1433

Chip reliability test is mainly divided into two major items: environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, outgoing line tensile strength test and outgoing line bending test), outgoing line weldability test, temperature test (low temperature, high temperature and temperature alternating test) Damp heat test (constant humidity and alternating damp heat), special test (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be done selectively.

The purpose of an electronic equipment reliability test is usually to:

1. In the development stage, it is used to expose the defects of trial products in all aspects and evaluate the reliability of products to achieve the predetermined indicators;

2. Provide information for monitoring the production process in the production stage;

3. Determine or accept the reliability of finalized products;

4. Expose and analyze the failure rules of products under different environments and stress conditions, as well as relevant failure modes and mechanisms;

5. In order to improve the reliability of products and provide basis for users to select products, formulate and improve the reliability test scheme.

Generally, reliability tests can be divided into five categories:

A. Environmental test B. life test C. screening test D. field service test E. qualification test.

Reliability test standard:

Environmental testing of electrical products - Part 2: Test methods, test FC and guiding principles: vibration (sinusoidal) GB / t2423 10-2008/IEC60068-2-6:1995。

Environmental testing of electrical products - Part 2: Test methods Fh: broadband random vibration (digital control) and guidelines GB / t2423 56-2006/IEC60068-2-64:1993。

Electrical and electrical environmental tests Part 2: Test methods Test fi: vibration mixed mode GB / t2423 58-2008/EC60068-2-80:2005。

Inspection of packaging - basic inspection - Part 7: sinusoidal constant frequency vibration test method GB / T4857 7-2005/ISO2247:2000。

QC / t413-2002 basic specification for automotive electrical equipment.

Military equipment laboratory environmental test methods Part 16: vibration test GJB150 16A-2009。

Gjb367a-2001 general specification for military communication equipment

Gjb322a-1998, general rules for military computers.

Gjb3947a-2009 general specification for military electronic test equipment

Test methods and procedures for microelectronic devices gjb548b-2005.

Test methods for electrical and electrical components gjb360b-2009.

Environmental stress screening method for electronic devices gjb1032-1990.

Marine electronic equipment environmental test vibration test gjb4 7-1983。

Vibration test method for rail transit signal equipment TB / t2846-1997.

Electronic equipment of railway rolling stock GB / t25119-2010 / iec60571:2006.

Inspection basis of packaging and transport packaging: Part 23: random vibration test method GB / T4857 23-2012。

Impact and vibration test of railway rolling stock equipment GB / t21563-2008iec6137:1999.

GB / t6587-2012 general specification for electronic measuring instruments.

The main factors affecting the reliability of electronic products are:

(1) Natural environment.

Electronic devices are greatly affected by environmental factors, such as temperature Humidity Salt spray Air pressure Altitude Air pollution particles, etc Will affect the normal operation of electronic components, reduce their electrical performance, and even damage components and lead to faults.

(2) Mechanical construction.

The mechanical structure design of electronic devices should meet the requirements of service conditions. Strong mechanical vibration or collision will cause mechanical damage and deformation to the equipment, and even cause physical damage or failure of electronic components, making them unable to work normally.

(3) Electromagnetic environment.

Electromagnetic waves are everywhere in the environment. When electronic products are running, they are in contact with electromagnetic signals in space all the time. Under the influence of electromagnetic wave signal, the noise of electronic circuit will become larger and the stability will become worse. If the interference is serious, it will even cause equipment operation failure or endanger personal safety.

(4) Assembly process.

In addition to component quality and design factors, the manufacturing process will also directly affect the reliability of products. The inconsistency of assembly process will directly affect the firmness, sealing and environmental corrosion resistance of connections, thus affecting the quality and reliability of electronic products.

In fact, in addition to the use reliability, the internal reliability and environmental adaptability of electronic products are designed by the designer Determined by the manufacturing process, that is, after manufacturing, the main reliability indexes of electronic devices have been determined, and the external environment is only a test of their reliability. Therefore, the key to improve the reliability of electronic products is to improve the design and manufacturing level.

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