Electronic components X-ray scanning detection of counterfeit components

Date：2021-12-15 15:14:47Views：1081

X-ray, commonly known as X-ray, has the function of penetrating the object for perspective, so it is often used to detect the internal defects of the object. It has a wide range of applications, among which the electronic semiconductor industry needs to test the product quality with the help of the performance of X-ray testing equipment. Electronic semiconductors often need to detect SMT and circuit board patches. The items to be detected include internal bubbles, internal slag inclusion, inclusions, cracks, missing soldering, etc.

Due to technological progress, the shape of forged parts becomes more and more realistic, the number is increasing, and the difficulty of recognition is also increasing. Visual inspection can hardly detect counterfeit products. Therefore, the identification of suspicious and counterfeit components needs to be evaluated by professional testing instruments and methods, such as scanning electron microscope, X-ray testing equipment, perspective microscope, scanning electron microscope / energy spectrum, unpacking chip, scanning ultrasonic microscope, voan tracer, etc. X-ray is X-ray. Its principle is to use the characteristics that X-ray can penetrate non-metallic substances to check whether the lower parts of components such as BGA are well welded and whether there is short circuit. X-rays have strong penetration, can penetrate all kinds of ordinary objects, and leave black spots where they cannot penetrate. It uses the principle that different materials absorb different light to realize imaging, so as to test products.

The performance and reliability of Forged (counterfeit) electronic components are far from the original products due to the limitations of their manufacturing technology and equipment; Due to repeated welding and long-term use, the performance and reliability of refurbished forged electronic components are greatly reduced in the refurbishment process. No matter which fake component is used, it will lead to premature failure of the whole product or have a negative impact on the stability and reliability of the product. According to the latest report issued by the authorities, counterfeiting incidents have increased by more than 200% in the past decade. Driven by profits, in addition to counterfeit electronic components, illegal suppliers also sell refurbished IC and other electronic components as original equipment, which is also the main source of counterfeit equipment.

Traditional destructive physical analysis (DPA) and failure analysis (FA) are limited by their professionalism, destructiveness, timeliness and cost, and are limited to a few scientific research institutions. Enterprises equipped with experimental equipment and human resources have no implementation conditions.In contrast, X-ray examination is nondestructive, fast, easy to use and relatively low cost, which is favored by more and more electronic product manufacturers. X-ray inspection can be used to check the internal status of components, such as chip layout, lead layout and lead frame design, solder ball (lead), etc. For the components with complex structure, the angle, voltage, current, and the contrast and brightness of the X-ray tube can be adjusted to obtain effective image information, which can be compared with the original genuine products or with the data sheet of the original components to identify the authenticity of the equipment.

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