What are the main reliability testing methods for electronic components?

Date：2021-12-13 16:36:00Views：1270

Speaking of electronic components, we should not be unfamiliar. What about the reliability of electronic components? The reliability of electronic components is an important factor affecting product reliability. Reliability test is to determine whether the products transferred to mass production through reliability identification test meet the specified reliability requirements under specified conditions, and to verify whether the reliability of products decreases with the changes of process, tooling, workflow, parts quality and other factors during mass production. Only through these, can the product performance be trusted and the product quality be excellent.

The purpose of electronic product reliability test usually includes the following aspects:

1. In the development stage, it is used to expose the defects of trial products in all aspects and evaluate whether the product reliability reaches the predetermined index;

2. Provide information for monitoring the production process in the production stage;

3. Carry out reliability appraisal or acceptance of finalized products;

4. Expose and analyze the failure rules, relevant failure modes and failure mechanisms of products under different environments and stress conditions;

5. In order to improve product reliability, formulate and improve reliability test scheme, and provide basis for users to select products.

Methods and classification of reliability test for electronic products:

1、 If divided by environmental conditions, it can be divided into simulation test and field test under various stress conditions;

2、 Divided by test items, it can be divided into environmental test, life test, accelerated test and various special tests;

3、 If it is divided according to the purpose of the test, it can be divided into screening test, identification test and acceptance test;

4、 If divided according to the nature of the test, it can also be divided into destructive test and non-destructive test.

The commonly used classification method is to classify reliability tests into five categories:

A. Environmental test B. life test C. screening test D. field service test E. qualification test

What are the classification of reliability environmental test?

In some reliability monographs, the test of placing samples in natural or artificial simulated storage, transportation and working environment is collectively referred to as environmental test. It is to assess the adaptability of products under various environmental conditions (vibration, impact, centrifugation, temperature, thermal shock, hot tide, salt spray, low air pressure, etc.), and it is one of the important test methods to evaluate product reliability.

Generally, there are the following types:

1. Stability baking, i.e. high temperature storage test

Test purpose: to assess the impact of high temperature storage on products without applying electrical stress. Products with serious defects are in non-equilibrium state, which is an unstable state. The transition process from non-equilibrium state to equilibrium state is not only the process of inducing the failure of products with serious defects, but also the process of promoting the transition of products from unstable state to stable state.

2. Temperature cycling test

Test purpose: to assess the product's ability to withstand a certain temperature change rate and extreme high temperature and extreme low temperature environment It is set for the thermomechanical properties of the product. When the thermal matching of the materials constituting each part of the product is poor or the internal stress of the part is large, the temperature cycle test can lead to the failure of the product caused by the deterioration of mechanical structure defects. Such as air leakage, internal lead fracture, chip crack, etc.

3. Thermal shock test

Test purpose: to assess the product's ability to withstand severe temperature change, that is, large temperature change rate. The test can lead to the failure of the product caused by the deterioration of mechanical structure defects The purpose of thermal shock test is basically the same as that of temperature cycle test, but the conditions of thermal shock test are much more severe than that of temperature cycle testThe heat capacity is an important factor to ensure the test conditions.

4. Low pressure test

Test purpose: to assess the adaptability of the product to low pressure working environment (such as high-altitude working environment). When the air pressure decreases, the insulation strength of air or insulating materials will weaken; It is easy to produce corona discharge, increase dielectric loss and ionization; The decrease of air pressure will worsen the heat dissipation conditions and increase the temperature of components. These factors will cause the sample to lose the specified function under low air pressure, and sometimes cause permanent damage.

5. Moisture resistance test

Test purpose: To evaluate the decay resistance of microcircuit under humid and hot conditions by applying accelerated stress, which is designed for typical tropical climate environment. The main decay mechanism of microcircuit under wet and hot conditions is the physical process of corrosion caused by chemical process and the increase of microcrack caused by water vapor immersion, condensation and icing. The test also examines the possibility of occurrence or intensification of electrolysis of microcircuit materials under wet and hot conditions. Electrolysis will change the resistance of insulating materials and weaken the ability to resist dielectric breakdown.

6. Salt spray test

Test purpose: To evaluate the corrosion resistance of exposed parts of components and parts under salt fog, humid and hot conditions by accelerated method, which is designed for tropical seaside or marine climate environment The exposed parts of components with poor surface structure will be corroded under salt fog, Hunan humidity and hot conditions.

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