Third party inspection mechanism for IC appearance size machine vision inspection chip

Date：2021-12-07 16:36:25Views：1687

Chip is the most basic semiconductor material for IC production. The quality of chip determines the quality of IC finished products. The chip size detection system detects the position and size of each part of the chip. Before processing the chip, it is very important to strictly detect the appearance and size of the chip, which is conducive to the subsequent processing and improve the chip processing efficiency. After the chip size detection system is simply set, it can automatically detect and calculate. In case of abnormality, it can prompt the alarm or control the machine to stop. Ng signal can be output after detecting the workpiece that does not meet the requirements.

Machine vision detection technology is an intelligent measurement and control technology that uses machine vision to detect, measure, analyze, judge and control decisions on behalf of human eyes and hands. Compared with other detection technologies, its advantages mainly include: high degree of intelligence, comprehensive information collection, high detection rate, high precision and so on. In the process of chip manufacturing, almost any link, including ion implantation, polishing and etching, will form defects due to inaccurate technology or external environmental pollution, resulting in the final failure of the chip.

There are three types of common appearance defects of chips:

1. Redundancy: including nano-sized micro particles, micron sized dust, residues of relevant processes, etc.

2. Crystal defects: slip line defects, stacking faults, etc.

3. Mechanical damage: scratches, etc. generally occur in the polishing, slicing and other steps in the chip manufacturing process, and are caused by chemical mechanical grinding. It is a serious chip surface defect, which can have a very serious impact on the integrated circuit chip.

The visual inspection equipment can measure the chip size and detect the appearance defects such as scratches, bumps, damages, cracks, pores, foreign matters, pollution, poor nickel layer and so on. In order to prevent defective wafers from flowing into subsequent processes, strict testing must be carried out. Compared with traditional manual detection, machine vision detection has the advantages of high precision, high efficiency, continuity and non-contact pollution avoidance. It can effectively identify chip surface defects, classify and mark them, and assist chip sorting.

The main functions of chip size detection system are described

1. Size of detection chip:

2. Output the value of each test item;

3. Test items can be selected;

4. Continuous operation and automatic discrimination;

5. The detection accuracy is adjustable;

6. Visual inspection speed: 200ms / PCS;

7. Store the detected data in the exclude file, save the statistical data for data processing and printing, and save the images of NG products for viewing;

8. The system has self-learning function, and the learning process is simple to operate;

9. The alarm light is displayed on the system interface, and the alarm light of NG product appears

10. Pin position with unqualified foot length will be prompted on the system interface.

At present, China's intelligent manufacturing equipment industry is developing rapidly. In the process of independent innovation, there is a huge and urgent demand for intelligent technologies such as machine vision detection and control. In the process of manufacturing products, surface defects are often inevitable. Surface defects not only affect the beauty and comfort of products, but also generally have an adverse impact on their service performance. Therefore, manufacturers attach great importance to the detection of product surface defects in order to find them in time and effectively control product quality.